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657-25ABPN

Description
Heat Sink, Adhesive, U, Aluminum, Anodized
CategoryHeat resisting bracing    Heat sinks   
File Size263KB,7 Pages
ManufacturerWakefield-Vette
Websitehttp://www.wakefield-vette.com/
Download Datasheet Parametric View All

657-25ABPN Overview

Heat Sink, Adhesive, U, Aluminum, Anodized

657-25ABPN Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWakefield-Vette
Reach Compliance Codeunknown
Is SamacsysN
Main materialALUMINUM
colorBLACK
structureADHESIVE
Surface layerANODIZED
high25.4 mm
length63.5 mm
contourU
Heat Resistant Support Device TypeHEAT SINK
width41.9 mm
Base Number Matches1
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
216 SERIES
Standard
P/N
216-40CT
216-40CTT
216-40CTR
Surface Mount Heat Sinks
Height Above
PC Board
.390 in. (9.9)
.390 in. (9.9)
.390 in. (9.9)
Footprint Dimensions
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
25
250
D
2
PAK, TO-220, SOL-20
Thermal Performance at Typical Load
Natural Convection
Forced Convection
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
PATENT 361317
Increase the power dissipation level of D
2
PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of
high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder
reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path
from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk,
tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated.
216-40CTR
A
RECOMMENDED COPPER FOOTPRINT
USE MAX
COPPER
TO ALLOW
MAX
CONDUCTION
TO HEAT SINK
.660
(16.8)
.640
(16.3)
.660
(16.8)
.640
(16.3)
COPPER FOOTPRINT
FOR HEAT SINK
MIN COPPER
FOR HEAT
SINK
1.260
(32.0)
.390
(9.9)
REF:
JEDEC TO-263 D
2
PAK
JEDEC TO-220AB
JEDEC TO-261AA
JEDEC MO-184
JEDEC MS-013
JEDEC MS-025
MECHANICAL DIMENSIONS
.740
(18.8)
6 LAYER BOARD, D
2
PAK
125°C LEAD, 40°C AMBIENT
AIR VELOCITY (LFM)
POWER DISSIPATION, W
7
6
5
4
3
2
1
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
NO HEAT SINK
0
100
200
300
400
500
216-40CT
TAPE
DETAILS
.600
(15.2)
.626
(15.9)
A
.060
(1.5)
SECTION
A-A
.640
(16.3)
.215
(5.5)
.600
(15.2)
.020
(0.5)
.600
(15.2)
.390
(9.9)
.215
(5.5)
.020
(0.5)
.768
(19.5)
.945
(24.0)
REEL
DETAILS
13.000
(330.2)
.409
(10.4)
.215
(5.5)
216-40CTT
NOTES:
1. ESD MATERIAL WITH PLUGS
2. LENGTH OF TUBE: 16.25 INCHES
3. QUANTITY PER TUBE: 25 PIECES
TUBE DETAILS
.390
(9.9)
.640
(16.3)
.265
(6.7)
1.28
(32.5)
.470
(11.9)
NOTES:
1. ESD MATERIAL
2. EIA STANDARD, EIA-481-3
3. LENGTH OF REEL: APPROXIMATELY 6 METERS
4. QUANTITY PER REEL: 250 PIECES
NATURAL CONVECTION
6 LAYER BOARD, D
2
PAK
125°C LEAD, 40°C AMBIENT
POWER, W
TEMPERATURE RISE,
°C
100
80
60
40
20
0
HS, 2 IN. BOARD
HS, 4 IN. BOARD
THERMAL PERFORMANCE
DATA
6 LAYER BOARD, D
2
PAK
AIR VELOCITY (LFM)
0
100
200
300
400
500
THERMAL RESISTANCE, C/W
30
25
20
15
10
0
.840
(21.3)
.350
(8.9)
.025
(0.6)
NO HS, 2 IN. BOARD
NO HS, 4 IN. BOARD
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
Dimensions: in. (mm)
230 and 234 SERIES
Standard
P/N
230-75AB
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
234-75AB-01
234-75AB-05
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Footprint Dimensions
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.750 in. (19.1) x .570 in. (14.5)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.790 in. (20.0) x .570 in. (14.5)
Mounting
Solderable
Configuration Tab Option
Vert./Horiz.
No Tab
Vertical
01
Horizontal
05
Vertical
10
Vert./Horiz.
No Tab
Vertical
01
Horizontal
05
TO-220
PATENT PENDING
Height Above
PC Board
.750 in. (19.1)
.750 in. (19.1)
.500 in. (12.7)
.875 in. (22.2)
.790 in. (20.0)
.790 in. (20.0)
.500 in. (12.7)
Mounting
Thermal Performance at Typical Load
Style
Natural Convection Forced Convection
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Clip/Mtg Hole
57°C @ 2W
7.5°C/W @ 400 LFM
Compact, slim, labor-saving heat sinks with integral self locking features for TO-220 semiconductors. Their unique design (patent pending) ensures
uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating
the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used
interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10
to the standard part number (i.e. 230-75AB-01). Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.500
(12.7)
.570 MAX
(14.5)
.125
(3.2)
.500
(12.7)
.750
(19.1)
.050
(1.3)
230-75AB
.500
(12.7)
.570 MAX
(14.5)
.500
(12.7)
.250
(6.4)
.063
(1.6)
234-75AB-01
.090
(2.3)
.210
(5.3)
230-75AB-01
230-75AB-10
230 AND 234 SERIES
.570 MAX
(14.5)
230
and
234
SERIES
.375
(9.5)
.020 TAB 10
(0.5)
.032 TAB 01
(0.8)
.050
(1.3)
.500 MIN
(12.7)
230-75AB-05
.750
(19.1)
230 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
HEAT SINK TEMPERATURE
RISE ABOVE AMBIENT AIR (
˚
C)
.032
(0.8)
AIR VELOCITY (LFM)
100
80
60
40
20
0
0
1
2
3
4
5
230/234
10
8
6
4
2
0
234-75AB
.720 .790
(18.3) (20.1)
234-75AB-05
2x.100
(2.5)
234 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
.370
(9.4)
230/234
.540
(13.7)
.720 .790
(18.3) (20.1)
.430
(10.9)
.032
(0.8)
.165
(4.2)
2x.125
(3.2)
Dimensions: in. (mm)
.032
(0.8)
.050
(1.3)
.500
(12.7)
POWER DISSIPATION (WATTS)
Wakefield Engineering, Inc.
60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874
2
Refer to
Full Line Catalog
for additional
Board-Level Heat Sinks and
Thermal Accessory Products
THERMAL RESISTANCE
SINK TO AMBIENT (
˚
C/WATT)
.165
(4.2)
0
200
400
600
800
1000
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