Series LB66B1
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
Part Number Series LB66B1
Natural Conv. (°C/W): 17.1
Forced Air (°C/W): 5.3
Mounting Envelope: 1.40" x 1.12" x .50"
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
•
•
Thermal Resistance Case to Sink is 0.5-0.7
°C/W
w/Joint Compound.
Derate 1.4
°C/watt
for unplated part in natural convection only.
Ordering Information
CTS IERC PART NO.
Comm'l. Black
Mil. Black
Anodize
Anodize
LB66B1-76U
LB66B1-76CB LB66B1-76B
LB66B1U
LB66B1CB
LB66B1B
LB66B1-67U
LB66B1-67CB LB66B1-67B
LB66B1-77U
LB66B1-77CB LB66B1-77B
Unplated
Semiconductor
Accommodated
Undrilled
TO-66
TO-66 IC
TO-66 IC
(Socket)
Hole patt. ref.
no.
--
9
7
10
Max. Weight
(Grams)
6.2
6.2
6.2
6.2
HOLE PATTERNS
9.
Hole Pattern no. 133 accommodates TO-66s. Available in LB
7.
Hole pattern no. 191 accommodates To-66 Ics. Available in
series heat dissipators only.
LA-A, LA-B, and LB series heat dissipators only.
10.
Hole pattern no. 225 accommodates TO-66 ICs (socket).
Available in LB series heat dissipators only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502
Tel: (818) 842-7277
Fax: (818) 848-8872
Rev. 08-29-03
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