AM49DL640AG85IT datasheet, PDF

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AM49DL640AG85IT: DescriptionStacked Multi-Chip Package (MCP) Flash Memory and SRAM; Categorystorage storage; File Size512KB，65 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM49DL640AG85IT Overview

Stacked Multi-Chip Package (MCP) Flash Memory and SRAM

AM49DL640AG85IT Parametric

Parameter Name	Attribute value
Parts packaging code	BGA
package instruction	LFBGA, BGA73,10X12,32
Contacts	73
Reach Compliance Code	compliant
Maximum access time	85 ns
Other features	PSEUDO SRAM IS ORGANISED AS 1M X 16; FLASH CAN ALSO BE ORGANISED AS 8M X 8
JESD-30 code	R-PBGA-B73
length	11.6 mm
memory density	67108864 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+PSRAM
Number of functions	1
Number of terminals	73
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA73,10X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	3 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum standby current	0.00007 A
Maximum slew rate	0.045 mA
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm
Base Number Matches	1

AM49DL640AG85IT Related Products

	AM49DL640AG85IT	AM49DL640AG70IT	AM49DL640AG85IS	AM49DL640AG	AM49DL640AG70IS
Description	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM	Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Parts packaging code	BGA	BGA	BGA	-	BGA
package instruction	LFBGA, BGA73,10X12,32	LFBGA, BGA73,10X12,32	LFBGA, BGA73,10X12,32	-	LFBGA, BGA73,10X12,32
Contacts	73	73	73	-	73
Reach Compliance Code	compliant	compliant	compliant	-	compli
Maximum access time	85 ns	70 ns	85 ns	-	70 ns
Other features	PSEUDO SRAM IS ORGANISED AS 1M X 16; FLASH CAN ALSO BE ORGANISED AS 8M X 8	PSEUDO SRAM IS ORGANISED AS 1M X 16; FLASH CAN ALSO BE ORGANISED AS 8M X 8	PSEUDO SRAM IS ORGANISED AS 1M X 16; FLASH CAN ALSO BE ORGANISED AS 8M X 8	-	PSEUDO SRAM IS ORGANISED AS 1M X 16; FLASH CAN ALSO BE ORGANISED AS 8M X 8
JESD-30 code	R-PBGA-B73	R-PBGA-B73	R-PBGA-B73	-	R-PBGA-B73
length	11.6 mm	11.6 mm	11.6 mm	-	11.6 mm
memory density	67108864 bit	67108864 bit	67108864 bit	-	67108864 bi
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	-	MEMORY CIRCUIT
memory width	16	16	16	-	16
Mixed memory types	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	-	FLASH+PSRAM
Number of functions	1	1	1	-	1
Number of terminals	73	73	73	-	73
word count	4194304 words	4194304 words	4194304 words	-	4194304 words
character code	4000000	4000000	4000000	-	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-	-40 °C
organize	4MX16	4MX16	4MX16	-	4MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	-	LFBGA
Encapsulate equivalent code	BGA73,10X12,32	BGA73,10X12,32	BGA73,10X12,32	-	BGA73,10X12,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	-	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	3 V	3 V	3 V	-	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	1.4 mm	1.4 mm	1.4 mm	-	1.4 mm
Maximum standby current	0.00007 A	0.00007 A	0.00007 A	-	0.00007 A
Maximum slew rate	0.045 mA	0.045 mA	0.045 mA	-	0.045 mA
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	-	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	-	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	-	3 V
surface mount	YES	YES	YES	-	YES
technology	CMOS	CMOS	CMOS	-	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL
Terminal form	BALL	BALL	BALL	-	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	-	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM
width	8 mm	8 mm	8 mm	-	8 mm
Base Number Matches	1	1	1	-	-

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