Buffers & Line Drivers 1.8V SINGLE SCHMITT
| Parameter Name | Attribute value |
| Brand Name | NXP Semiconductor |
| Is it Rohs certified? | conform to |
| Parts packaging code | SON |
| package instruction | VSON, SOLCC6,.04,20 |
| Contacts | 6 |
| Manufacturer packaging code | SOT886 |
| Reach Compliance Code | compliant |
| series | AUP/ULP/V |
| JESD-30 code | R-PDSO-N6 |
| JESD-609 code | e3 |
| length | 1.45 mm |
| Load capacitance (CL) | 30 pF |
| Logic integrated circuit type | BUFFER |
| MaximumI(ol) | 0.0017 A |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of entries | 1 |
| Number of terminals | 6 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VSON |
| Encapsulate equivalent code | SOLCC6,.04,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, VERY THIN PROFILE |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.2/3.3 V |
| Prop。Delay @ Nom-Sup | 20.1 ns |
| propagation delay (tpd) | 20.1 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Maximum seat height | 0.5 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 0.8 V |
| Nominal supply voltage (Vsup) | 1.1 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Tin (Sn) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 1 mm |
| Base Number Matches | 1 |
| 74AUP1G17GM,115 | 74AUP1G17GN,132 | 74AUP1G17GM,132 | 74AUP1G17GF,132 | 74AUP1G17GX,125 | 74AUP1G17GS,132 | 74AUP1G17GW,125 | |
|---|---|---|---|---|---|---|---|
| Description | Buffers & Line Drivers 1.8V SINGLE SCHMITT | Buffers & Line Drivers 3.6 V XSON6 | Buffers & Line Drivers 1.8V SINGL LOW-PWR | Buffers & Line Drivers 1.8V SINGL LOW-PWR | Buffers & Line Drivers 74AUP1G17GX/X2SON5/REEL 7" Q3/ | Buffers & Line Drivers 3.6 V XSON6 | Buffers & Line Drivers 1.8V SINGLE SCHMITT |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | conform to |
| package instruction | VSON, SOLCC6,.04,20 | SON, SOLCC6,.04,12 | VSON, SOLCC6,.04,20 | VSON, SOLCC6,.04,14 | SON, LCC5(UNSPEC) | VSON, SOLCC6,.04,14 | 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 |
| Manufacturer packaging code | SOT886 | SOT1115 | SOT886 | SOT891 | SOT1226 | SOT1202 | SOT353-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| series | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 code | R-PDSO-N6 | R-PDSO-N6 | R-PDSO-N6 | S-PDSO-N6 | S-PDSO-N5 | S-PDSO-N6 | R-PDSO-G5 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| length | 1.45 mm | 1 mm | 1.45 mm | 1 mm | 0.8 mm | 1 mm | 2.05 mm |
| Load capacitance (CL) | 30 pF | 30 pF | 30 pF | 30 pF | 30 pF | 30 pF | 30 pF |
| Logic integrated circuit type | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER | BUFFER |
| MaximumI(ol) | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A | 0.0017 A |
| Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of entries | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 6 | 6 | 6 | 6 | 5 | 6 | 5 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VSON | SON | VSON | VSON | SON | VSON | TSSOP |
| Encapsulate equivalent code | SOLCC6,.04,20 | SOLCC6,.04,12 | SOLCC6,.04,20 | SOLCC6,.04,14 | LCC5(UNSPEC) | SOLCC6,.04,14 | TSSOP5/6,.08 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| Package form | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| power supply | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V | 1.2/3.3 V |
| Prop。Delay @ Nom-Sup | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns |
| propagation delay (tpd) | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns | 20.1 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | YES | YES | YES | YES | YES | YES | YES |
| Maximum seat height | 0.5 mm | 0.35 mm | 0.5 mm | 0.5 mm | 0.35 mm | 0.35 mm | 1.1 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| Nominal supply voltage (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING |
| Terminal pitch | 0.5 mm | 0.3 mm | 0.5 mm | 0.35 mm | 0.48 mm | 0.35 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 1 mm | 0.9 mm | 1 mm | 1 mm | 0.8 mm | 1 mm | 1.25 mm |
| Parts packaging code | SON | SON | SON | SON | SON | - | TSSOP |
| Contacts | 6 | 6 | 6 | 6 | 5 | - | 5 |
| Peak Reflow Temperature (Celsius) | 260 | - | 260 | 260 | - | - | 260 |
| Maximum time at peak reflow temperature | 30 | - | 30 | 30 | - | - | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 | - | 1 | 1 |
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