|
MAX4854HLETE-T |
MAX4854HLETE |
MAX4854HETE |
MAX4854HETE-T |
Description |
Analog Switch ICs |
Analog Switch ICs |
Analog Switch ICs |
Analog Switch ICs |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
Maker |
Maxim |
Maxim |
Maxim |
Maxim |
Parts packaging code |
QFN |
QFN |
QFN |
QFN |
package instruction |
3 X 3 MM, 0.80 MM HEIGHT, MO-220WEED-2, TQFN-16 |
3 X 3 MM, 0.80 MM HEIGHT, MO-220WEED-2, TQFN-16 |
3 X 3 MM, 0.80 MM HEIGHT, MO-220WEED-2, TQFN-16 |
3 X 3 MM, 0.80 MM HEIGHT, MO-220WEED-2, TQFN-16 |
Contacts |
16 |
16 |
16 |
16 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
not_compliant |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
SPST |
JESD-30 code |
S-XQCC-N16 |
S-XQCC-N16 |
S-XQCC-N16 |
S-XQCC-N16 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
length |
3 mm |
3 mm |
3 mm |
3 mm |
normal position |
NC |
NC |
NO |
NO |
Number of channels |
1 |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
4 |
Number of terminals |
16 |
16 |
16 |
16 |
Nominal off-state isolation |
80 dB |
80 dB |
80 dB |
80 dB |
On-state resistance matching specifications |
0.2 Ω |
0.2 Ω |
0.2 Ω |
0.2 Ω |
Maximum on-state resistance (Ron) |
9 Ω |
9 Ω |
9 Ω |
9 Ω |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
HVQCCN |
HVQCCN |
HVQCCN |
HVQCCN |
Encapsulate equivalent code |
LCC16,.12SQ,20 |
LCC16,.12SQ,20 |
LCC16,.12SQ,20 |
LCC16,.12SQ,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
245 |
245 |
NOT SPECIFIED |
power supply |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.8 mm |
0.8 mm |
0.8 mm |
0.8 mm |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2 V |
2 V |
2 V |
2 V |
Nominal supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
Maximum disconnect time |
40 ns |
40 ns |
40 ns |
40 ns |
Maximum connection time |
60 ns |
60 ns |
60 ns |
60 ns |
switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3 mm |
3 mm |
3 mm |
3 mm |
Base Number Matches |
1 |
- |
1 |
1 |