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MIC4124YML-TR

Description
Gate Drivers
Categorysemiconductor    Power management   
File Size358KB,11 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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MIC4124YML-TR Overview

Gate Drivers

MIC4124YML-TR Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerMicrochip
Product CategoryGate Drivers
RoHSDetails
Mounting StyleSMD/SMT
Package / CaseMLF-8
ProductMOSFET Gate Drivers
PackagingReel
Factory Pack Quantity5000

MIC4124YML-TR Related Products

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Description Gate Drivers Gate Drivers Gate Drivers Gate Drivers Gate Drivers Improved 3A Dual High Speed MOSFET Driver (Inverting/Non-Inverting) Gate Drivers Improved 3A Dual High Speed MOSFET Driver (Inverting)
Is it Rohs certified? - conform to conform to conform to conform to conform to
Maker - Microchip Microchip Microchip Microchip Microchip
package instruction - SOIC-8 HLSOP, VDFN-8 HLSOP, HLSOP, SOP8,.24
Reach Compliance Code - unknown compliant compliant compliant compliant
Factory Lead Time - 7 weeks 14 weeks 13 weeks 7 weeks 7 weeks
Interface integrated circuit type - BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code - R-PDSO-G8 R-PDSO-G8 S-XDSO-N8 R-PDSO-G8 R-PDSO-G8
length - 4.89 mm 4.93 mm 4 mm 4.93 mm 4.89 mm
Number of functions - 1 2 1 2 1
Number of terminals - 8 8 8 8 8
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C -40 °C
Nominal output peak current - 3 A 3 A 3 A 3 A 3 A
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY UNSPECIFIED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - HLSOP HLSOP HVSON HLSOP HLSOP
Package shape - RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Maximum seat height - 1.68 mm 1.68 mm 0.9 mm 1.68 mm 1.68 mm
Maximum supply voltage - 20 V 20 V 20 V 20 V 20 V
Minimum supply voltage - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
surface mount - YES YES YES YES YES
technology - BCDMOS BCDMOS BCDMOS BCDMOS BCDMOS
Temperature level - AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form - GULL WING GULL WING NO LEAD GULL WING GULL WING
Terminal pitch - 1.27 mm 1.27 mm 0.65 mm 1.27 mm 1.27 mm
Terminal location - DUAL DUAL DUAL DUAL DUAL
width - 3.9 mm 3.94 mm 4 mm 3.94 mm 3.9 mm
ECCN code - - EAR99 EAR99 EAR99 EAR99
Built-in protection - - TRANSIENT TRANSIENT TRANSIENT TRANSIENT
JESD-609 code - - e3 e4 e3 e3
Output current flow direction - - SOURCE AND SINK SINK SINK SINK
Peak Reflow Temperature (Celsius) - - 260 260 260 260
Terminal surface - - Matte Tin (Sn) - annealed Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Maximum time at peak reflow temperature - - 30 40 40 40
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