Gate Drivers SYNCHCT BUCK MSFT W/ INTERNAL 3OHM
| Parameter Name | Attribute value |
| Brand Name | Intersil |
| Maker | Renesas Electronics Corporation |
| Parts packaging code | QFN, SOIC |
| package instruction | 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220VEEC, QFN-8 |
| Contacts | 8, 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 6 weeks |
| high side driver | YES |
| Interface integrated circuit type | AND GATE BASED MOSFET DRIVER |
| JESD-30 code | S-PQCC-N8 |
| JESD-609 code | e3 |
| length | 3 mm |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Nominal output peak current | 4 A |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC8,.12SQ,25 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) - annealed |
| Terminal form | NO LEAD |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 3 mm |
| Base Number Matches | 1 |
| ISL6609AIRZ-T | ISL6609AIRZ-TK | ISL6609AIRZ | ISL6609AIBZ | ISL6609IBZ | ISL6609ACBZ | |
|---|---|---|---|---|---|---|
| Description | Gate Drivers SYNCHCT BUCK MSFT W/ INTERNAL 3OHM | Gate Drivers SYNCHCT BUCK MSFT W/ INTERNAL 3OHM | Gate Drivers SYNCHCT BUCK MSFT W/ INTERNAL 3OHM | Gate Drivers W/ANNEAL SYNCH BUCK W/INTERNAL 3OHM BO | Gate Drivers W/ANNEAL P6 SYNCHCT BUCK MSFT 8LD | Gate Drivers W/ANNEAL SYNCH BUCK W/INTERNAL 3OHM BO |
| Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Parts packaging code | QFN, SOIC | QFN | QFN, SOIC | QFN, SOIC | QFN, SOIC | QFN, SOIC |
| package instruction | 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220VEEC, QFN-8 | 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220VEEC, QFN-8 | 3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220VEEC, QFN-8 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| Contacts | 8, 8 | 8 | 8, 8 | 8, 8 | 8, 8 | 8, 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| high side driver | YES | YES | YES | YES | YES | YES |
| Interface integrated circuit type | AND GATE BASED MOSFET DRIVER | AND GATE BASED MOSFET DRIVER | AND GATE BASED MOSFET DRIVER | AND GATE BASED MOSFET DRIVER | AND GATE BASED MOSFET DRIVER | AND GATE BASED MOSFET DRIVER |
| JESD-30 code | S-PQCC-N8 | S-PQCC-N8 | S-PQCC-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 |
| length | 3 mm | 3 mm | 3 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| Nominal output peak current | 4 A | 4 A | 4 A | 4 A | 4 A | 4 A |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | HVQCCN | HVQCCN | HVQCCN | SOP | SOP | SOP |
| Encapsulate equivalent code | LCC8,.12SQ,25 | LCC8,.12SQ,25 | LCC8,.12SQ,25 | SOP8,.25 | SOP8,.25 | SOP8,.25 |
| Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1 mm | 1 mm | 1 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED | 30 | 30 | 30 | 30 |
| width | 3 mm | 3 mm | 3 mm | 3.9 mm | 3.9 mm | 3.9 mm |
| Brand Name | Intersil | - | Intersil | Intersil | Intersil | Intersil |
| Factory Lead Time | 6 weeks | - | 6 weeks | 1 week | - | 1 week |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
