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PI3USB221XAEX

Description
USB Switch ICs USB 2.0 HS compliant switch
CategoryAnalog mixed-signal IC    The signal circuit   
File Size1MB,13 Pages
ManufacturerDiodes Incorporated
Environmental Compliance
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PI3USB221XAEX Overview

USB Switch ICs USB 2.0 HS compliant switch

PI3USB221XAEX Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerDiodes Incorporated
package instruction,
Reach Compliance Codecompliant
ECCN codeEAR99
Analog Integrated Circuits - Other TypesDIFFERENTIAL MULTIPLEXER
JESD-30 codeR-XQCC-N10
Number of terminals10
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationQUAD
A product Line of
Diodes Incorporated
PI3USB221
High-Speed USB2.0 1:2 Multiplexer/DeMultiplexer Switch with Signal Enable
Features
• V
DD
Operation at 2.5 V and 3.3 V
• V
I/O
Accepts Signals up to 5.5 V
• 1.8-V Compatible Control-Pin Inputs
• Low-Power Mode When OE Is Disabled (2 µA)
• r
ON
= 6Ω Maximum
• Δr
ON
= 0.2Ω Typical
• Cio(on) = 6 pF Maximum
• Low Power Consumption (50 µA Maximum)
• ESD > 8kV contact on USB signal path per IEC61000-4-2)
• High Bandwidth (1.1 GHz Typical)
• Packaging (Pb-free & Green):
- 10-contact, TDFN (ZE10)
The PI3USB221 is a high-bandwidth switch specially designed
for the switching of high-speed USB 2.0 signals in handset and
consumer applications, such as cell phones, digital cameras,
and notebooks with hubs or controllers with limited USB I/Os.
The wide bandwidth (1.1 GHz) of this switch allows signals
to pass with minimum edge and phase distortion. The device
multiplexes differential outputs from a USB host device to one of
two corresponding outputs. The switch is bidirectional and offers
little or no attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high channel-to-channel
noise isolation, and is compatible with various standards, such as
high-speed USB 2.0 (480 Mbps).
Description
Applications
• Routes Signals for USB 1.0, 1.1, and 2.0
• Mobile Industry Processor Interface (MIPI) Signal Routing
Pin Configuration
TDFN Package
(Top View)
1D+
1D-
2D+
2D-
GND
1
2
3
4
5
10
9
8
7
6
VDD
S
D+
D-
OE
All trademarks are property of their respective owners.
17-0003
1
www.diodes.com
01/18/17

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