Video ICs NTSC/PAL Video Decoder
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Maxim |
| package instruction | , |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 6 weeks |
| Commercial integrated circuit types | COLOR SIGNAL DECODER |
| JESD-609 code | e3 |
| Humidity sensitivity level | 1 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Terminal surface | Matte Tin (Sn) |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| MAX9526AEI/V+T | MAX9526ATJ+ | MAX9526AEI+ | MAX9526AEI/V+ | |
|---|---|---|---|---|
| Description | Video ICs NTSC/PAL Video Decoder | Video ICs NTSC/PAL Video Decoder | Video ICs NTSC/PAL Video Decoder | Video ICs NTSC/PAL Video Decoder |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Maker | Maxim | Maxim | Maxim | Maxim |
| package instruction | , | HVQCCN, LCC32,.20X.25,20 | SSOP, SSOP28,.25 | SSOP, SSOP28,.25 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Commercial integrated circuit types | COLOR SIGNAL DECODER | COLOR SIGNAL DECODER | COLOR SIGNAL DECODER | COLOR SIGNAL DECODER |
| Humidity sensitivity level | 1 | 1 | 1 | 1 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Parts packaging code | - | QFN | SSOP | SSOP |
| Contacts | - | 32 | 28 | 28 |
| JESD-30 code | - | R-XQCC-N32 | R-PDSO-G28 | R-PDSO-G28 |
| length | - | 6 mm | 9.89 mm | 9.89 mm |
| Number of functions | - | 1 | 1 | 1 |
| Number of terminals | - | 32 | 28 | 28 |
| Maximum operating temperature | - | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -40 °C | -40 °C | -40 °C |
| Package body material | - | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | - | HVQCCN | SSOP | SSOP |
| Encapsulate equivalent code | - | LCC32,.20X.25,20 | SSOP28,.25 | SSOP28,.25 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| power supply | - | 1.8,3.3 V | 1.8,3.3 V | 1.8,3.3 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 0.8 mm | 1.75 mm | 1.75 mm |
| Maximum slew rate | - | 110 mA | 110 mA | 110 mA |
| Maximum supply voltage (Vsup) | - | 1.9 V | 1.9 V | 1.9 V |
| Minimum supply voltage (Vsup) | - | 1.7 V | 1.7 V | 1.7 V |
| surface mount | - | YES | YES | YES |
| technology | - | CMOS | CMOS | CMOS |
| Temperature level | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal form | - | NO LEAD | GULL WING | GULL WING |
| Terminal pitch | - | 0.5 mm | 0.635 mm | 0.635 mm |
| Terminal location | - | QUAD | DUAL | DUAL |
| width | - | 5 mm | 3.9 mm | 3.9 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD