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TLRME17DPF

Description
Panel Circuit Indicator
File Size170KB,3 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TLRME17DPF Overview

Panel Circuit Indicator

TLRME17DP(F)
TOSHIBA LED Lamp
TLRME17DP(F)
Panel Circuit Indicator
Lead(Pb)-free products (lead: Sn-Ag-Cu)
5mm package
InGaAℓP technology
All plastic mold type
Diffused color lens
High intensity light emission
Excellent low current light output
Applications:
outdoor message signboards, safety equipment, automotive use, etc
Unit: mm
Lineup
JEDEC
Product Name
TLRME17DP(F)
Color
Red
Material
4-5AJ2
JEITA
TOSHIBA
InGaAlP
Absolute Maximum Ratings
(Ta
=
25°C)
Product Name
TLRME17DP(F)
Forward Current
I
F
(mA)
50
Reverse Voltage
V
R
(V)
4
Power Dissipation
P
D
(mW)
120
Weight: 0.31 g (Typ.)
Operating
Temperature
T
opr
(°C)
40~100
Storage
Temperature
T
stg
(°C)
40~120
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics
(Ta
=
25°C)
Product Name
Typ. Emission Wavelength
λ
d
λ
P
Δλ
Luminous Intensity
I
V
Min
153
mcd
Typ.
500
I
F
20
mA
Forward Voltage
V
F
Typ.
1.9
V
Max
2.4
I
F
20
mA
Reverse Current
I
R
Max
50
μ
A
I
F
20
mA
V
R
4
V
TLRME17DP(F)
Unit
626
(636)
nm
23
Precautions
Please be careful of the following:
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.
1
2007-10-01

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