CMOS Digital Integrated Circuit Silicon Monolithic Triple Non-Inverter
| Parameter Name | Attribute value |
| Maker | Toshiba Semiconductor |
| Parts packaging code | SON |
| package instruction | VSON, SOLCC8,.05,16 |
| Contacts | 8 |
| Reach Compliance Code | unknow |
| series | LVP |
| JESD-30 code | R-CDSO-N8 |
| JESD-609 code | e0 |
| length | 1.45 mm |
| Load capacitance (CL) | 30 pF |
| Logic integrated circuit type | BUFFER |
| MaximumI(ol) | 0.003 A |
| Number of functions | 3 |
| Number of entries | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | VSON |
| Encapsulate equivalent code | SOLCC8,.05,16 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, VERY THIN PROFILE |
| power supply | 1.2/3.3 V |
| Prop。Delay @ Nom-Su | 64.1 ns |
| propagation delay (tpd) | 64.1 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 0.4 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 0.9 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 0.4 mm |
| Terminal location | DUAL |
| width | 1.35 mm |
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