74AC151MTC datasheet, PDF - EEWORLD Datasheet

74AC151MTC: DescriptionIC,LOGIC MUX,SINGLE,8-INPUT,AC-CMOS,TSSOP,16PIN,PLASTIC; Categorylogic; File Size332KB，10 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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IC,LOGIC MUX,SINGLE,8-INPUT,AC-CMOS,TSSOP,16PIN,PLASTIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	TSSOP, TSSOP16,.25
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 code	R-PDSO-G16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	MULTIPLEXER
MaximumI(ol)	0.012 A
Number of functions	1
Number of entries	8
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
power supply	3.3/5 V
Prop。Delay @ Nom-Sup	16 ns
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.635 mm
Terminal location	DUAL
Base Number Matches	1

	74AC151MTC	74ACT151SJ
Description	IC,LOGIC MUX,SINGLE,8-INPUT,AC-CMOS,TSSOP,16PIN,PLASTIC	IC ACT SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PDSO16, 0.300 INCH, EIAJ, PLASTIC, SOIC-16, Multiplexer/Demultiplexer
Is it Rohs certified?	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	TSSOP, TSSOP16,.25	0.300 INCH, EIAJ, PLASTIC, SOIC-16
Reach Compliance Code	unknown	compliant
JESD-30 code	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e0	e0
Load capacitance (CL)	50 pF	50 pF
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER
MaximumI(ol)	0.012 A	0.024 A
Number of functions	1	1
Number of entries	8	8
Number of terminals	16	16
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SOP
Encapsulate equivalent code	TSSOP16,.25	SOP16,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
power supply	3.3/5 V	5 V
Prop。Delay @ Nom-Sup	16 ns	14 ns
Certification status	Not Qualified	Not Qualified
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.635 mm	1.27 mm
Terminal location	DUAL	DUAL
Base Number Matches	1	1

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