EEPROM Module, 512KX8, 250ns, Parallel, CMOS, CHIP66,
| Parameter Name | Attribute value |
| Maker | Microsemi |
| package instruction | , |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.C |
| Is Samacsys | N |
| Maximum access time | 250 ns |
| Other features | CONFIGURABLE AS 128K X 32; HARDWARE & SOFTWARE WRITE PROTECTION; DATA RETENTION > 10 YEARS |
| Spare memory width | 16 |
| Data retention time - minimum | 10 |
| JESD-30 code | S-CHIP-P66 |
| JESD-609 code | e0 |
| memory density | 4194304 bit |
| Memory IC Type | EEPROM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 66 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 512KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | SQUARE |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Programming voltage | 5 V |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | TIN LEAD |
| Terminal form | PIN/PEG |
| Terminal location | HEX |
| Base Number Matches | 1 |
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