64X4 OTHER FIFO, 50ns, CDIP20, CERAMIC, DIP-20
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Rochester Electronics |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 20 |
Reach Compliance Code | unknown |
Is Samacsys | N |
Maximum access time | 50 ns |
period time | 100 ns |
JESD-30 code | R-GDIP-T20 |
JESD-609 code | e0 |
length | 24.257 mm |
memory density | 256 bit |
memory width | 4 |
Number of functions | 1 |
Number of terminals | 20 |
word count | 64 words |
character code | 64 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 64X4 |
Exportable | NO |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | COMMERCIAL |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |