Application Specific SRAM, 8KX8, 55ns, CMOS, PQCC68
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
package instruction | QCCJ, LDCC68,1.0SQ |
Reach Compliance Code | not_compliant |
Maximum access time | 55 ns |
I/O type | COMMON |
JESD-30 code | S-PQCC-J68 |
JESD-609 code | e0 |
memory density | 65536 bit |
Memory IC Type | APPLICATION SPECIFIC SRAM |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of ports | 2 |
Number of terminals | 68 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum standby current | 0.004 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.25 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
Base Number Matches | 1 |