Hex Buffer High-Voltage Silicon-Gate CMOS
KK4503B | KK4503BD | KK4503BN | |
---|---|---|---|
Description | Hex Buffer High-Voltage Silicon-Gate CMOS | Hex Buffer High-Voltage Silicon-Gate CMOS | Hex Buffer High-Voltage Silicon-Gate CMOS |
Maker | - | KODENSHI | KODENSHI |
package instruction | - | SOP, SOP14,.25 | DIP, DIP14,.3 |
Reach Compliance Code | - | unknow | unknow |
Control type | - | ENABLE LOW | ENABLE LOW |
JESD-30 code | - | R-PDSO-G14 | R-PDIP-T14 |
Load capacitance (CL) | - | 50 pF | 50 pF |
Logic integrated circuit type | - | BUS DRIVER | BUS DRIVER |
Number of digits | - | 6 | 6 |
Number of functions | - | 2 | 2 |
Number of terminals | - | 14 | 14 |
Maximum operating temperature | - | 125 °C | 125 °C |
Minimum operating temperature | - | -55 °C | -55 °C |
Output characteristics | - | 3-STATE | 3-STATE |
Output polarity | - | TRUE | TRUE |
Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | - | SOP | DIP |
Encapsulate equivalent code | - | SOP14,.25 | DIP14,.3 |
Package shape | - | RECTANGULAR | RECTANGULAR |
Package form | - | SMALL OUTLINE | IN-LINE |
power supply | - | 5/15 V | 5/15 V |
Prop。Delay @ Nom-Su | - | 300 ns | 300 ns |
Certification status | - | Not Qualified | Not Qualified |
surface mount | - | YES | NO |
technology | - | CMOS | CMOS |
Temperature level | - | MILITARY | MILITARY |
Terminal form | - | GULL WING | THROUGH-HOLE |
Terminal pitch | - | 1.27 mm | 2.54 mm |
Terminal location | - | DUAL | DUAL |