High-Performance Impact-X PAL(R) Circuits 24-CDIP -55 to 125
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | DIP |
| package instruction | CERAMIC, DIP-24 |
| Contacts | 24 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A001.A.2.C |
| Architecture | PAL-TYPE |
| maximum clock frequency | 50 MHz |
| JESD-30 code | R-GDIP-T24 |
| length | 32.005 mm |
| Dedicated input times | 12 |
| Number of I/O lines | |
| Number of entries | 12 |
| Output times | 8 |
| Number of product terms | 64 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 12 DEDICATED INPUTS, 0 I/O |
| Output function | REGISTERED |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Programmable logic type | OT PLD |
| propagation delay | 10 ns |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8767116LA | 5962-8767117KA | 5962-87671173A | 5962-8767117LA | 5962-8767115KA | |
|---|---|---|---|---|---|
| Description | High-Performance Impact-X PAL(R) Circuits 24-CDIP -55 to 125 | High-Performance Impact-X PAL(R) Circuits 24-CFP -55 to 125 | High-Performance Impact-X PAL(R) Circuits 28-LCCC -55 to 125 | High-Performance Impact-X PAL(R) Circuits 24-CDIP -55 to 125 | High-Performance Impact-X PAL(R) Circuits 24-CFP -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Parts packaging code | DIP | DFP | QLCC | DIP | DFP |
| package instruction | CERAMIC, DIP-24 | CERAMIC, DFP-24 | CERAMIC, LCC-28 | CERAMIC, DIP-24 | CERAMIC, DFP-24 |
| Contacts | 24 | 24 | 28 | 24 | 24 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Architecture | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| maximum clock frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| JESD-30 code | R-GDIP-T24 | R-GDFP-F24 | S-CQCC-N28 | R-GDIP-T24 | R-GDFP-F24 |
| length | 32.005 mm | 14.355 mm | 11.43 mm | 32.005 mm | 14.355 mm |
| Dedicated input times | 12 | 12 | 12 | 12 | 14 |
| Number of I/O lines | - | 2 | 2 | 2 | 6 |
| Number of entries | 12 | 20 | 14 | 14 | 20 |
| Output times | 8 | 6 | 8 | 8 | 8 |
| Number of product terms | 64 | 64 | 64 | 64 | 64 |
| Number of terminals | 24 | 24 | 28 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 12 DEDICATED INPUTS, 0 I/O | 12 DEDICATED INPUTS, 2 I/O | 12 DEDICATED INPUTS, 2 I/O | 12 DEDICATED INPUTS, 2 I/O | 14 DEDICATED INPUTS, 6 I/O |
| Output function | REGISTERED | MIXED | MIXED | MIXED | COMBINATORIAL |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DFP | QCCN | DIP | DFP |
| Encapsulate equivalent code | DIP24,.3 | FL24,.4 | LCC28,.45SQ | DIP24,.3 | FL24,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Programmable logic type | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| propagation delay | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| Maximum seat height | 5.08 mm | 2.29 mm | 2.03 mm | 5.08 mm | 2.29 mm |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | YES |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 9.085 mm | 11.43 mm | 7.62 mm | 9.085 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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