FIFO, 64X4, 55ns, Asynchronous, TTL, CDIP16, CERAMIC, DIP-16
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 55 ns |
| Maximum clock frequency (fCLK) | 12 MHz |
| period time | 83.33 ns |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| length | 19.431 mm |
| memory density | 256 bit |
| Memory IC Type | OTHER FIFO |
| memory width | 4 |
| Number of functions | 1 |
| Number of terminals | 16 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 64X4 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 57L4013DJ/883B | 57L401DJ/883B | 57L402DJ/883B | |
|---|---|---|---|
| Description | FIFO, 64X4, 55ns, Asynchronous, TTL, CDIP16, CERAMIC, DIP-16 | FIFO, 64X4, 55ns, Asynchronous, TTL, CDIP16, CERAMIC, DIP-16 | FIFO, 64X5, 55ns, Asynchronous, TTL, CDIP18, CERAMIC, DIP-18 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD |
| Parts packaging code | DIP | DIP | DIP |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP18,.3 |
| Contacts | 16 | 16 | 18 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 55 ns | 55 ns | 55 ns |
| Maximum clock frequency (fCLK) | 12 MHz | 12 MHz | 12 MHz |
| period time | 83.33 ns | 83.33 ns | 83.33 ns |
| JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T18 |
| JESD-609 code | e0 | e0 | e0 |
| length | 19.431 mm | 19.431 mm | 22.86 mm |
| memory density | 256 bit | 256 bit | 320 bit |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 4 | 4 | 5 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 18 |
| word count | 64 words | 64 words | 64 words |
| character code | 64 | 64 | 64 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 64X4 | 64X4 | 64X5 |
| Output characteristics | 3-STATE | TOTEM POLE | TOTEM POLE |
| Exportable | YES | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm |
| Maximum slew rate | 0.12 mA | 0.12 mA | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO |
| technology | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 |
| power supply | - | 5 V | 5 V |
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