data sheet
Features:
LEADFRAME
PDIP
Amkor’s PDIP packages offer:
• 300 mil body width - 8, 14, 16, 18, 20, 22, 24 lead
counts available
• 288 mil body width - 28 lead count available
• 400 mil body width - 22 - 30 lead counts available
• 600 mil body width - 24, 28, 32, 40, 42, 48, 52 lead
counts available
• 750 mil body width - 64 lead count available
• High conductivity copper leadframe
• Fused-lead custom configurations
• JEDEC standard compliant
• Wide selection of available pad sizes to meet most die
size needs
• Custom leadframe design capability
• Multi-chip packaging capability
• Full internal electrical test
• Strip Test capability
Reliability:
Plastic Dual In-Line
(PDIP) Packages:
Amkor is committed to continuing to
service this long established standard
industry package. The Amkor PDIP
comes in a wide range of lead counts:
from 8 - 48 leads with a lead pitch of
100 mils. Amkor also provides the
SPDIP package which is a shrink version
of the PDIP with a 70 mil lead pitch and
lead counts ranging from 30 - 64 leads.
The SPDIP provides the option of
decreasing the package size while main-
taining the same lead count. The SPDIP
decreases the board space required on
the PCB to help meet ever-shrinking
space requirements.
PDIP and SPDIP are tested to assure reliable, long term
operation of your die.
•
•
•
•
PCT
Temp cycle
Temp/humidity
High temp storage
121 °C, 2 atm, 168 hours
-65/+150 °C, 1000 cycles
85 °C/85% RH, 1000 hours
150 °C, 1000 hours
Applications:
Along with the other standard industry packages, the PDIP has a proven track record and is still being used by semiconductor technologies such
as logic, memory, microcontrollers, and video controllers. Some end applications are consumer electronics, commercial electronics, automotive
and telecommunications.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS397D
Rev Date: 07’03
data sheet
PDIP
Cross-section PDIP
LEADFRAME
Process Highlights
Die thickness (max)
25 mils
Strip solder plating
85/15 Sn/Pb or 100% Sn
Marking
Pad & Laser
Lead inspection
Optical
Pack/ship options
Bar code
Test Services
• Program generation/Conversion
• Product engineering
• Wafer sort
• Ambient to +165 °C test available
• Burn-in
Shipping
Clear anti-static tube
20 inch
Configuration Options:
PDIP Nominal Package Dimensions
Lead
Count
300 mil (7.5 mm)
400 mil (10.16 mm)
600 mil (16.00 mm)
750 mil (18.9 mm)
300 MIL (7.5 mm)
22
30
42
52
56
64
8 1/2
14 full
16 1/2
18 full
20 full
24 full
28 - 3/4
22 full
24 full
28 full
32 full
40 full
48 full
Thkns
(mils)
130
150
150
150
150
150
130
130
130
130
130
130
130
150
150
150
150
150
160
Body
SPDIP
Body
Length
(mils)
1030
1095
1450
1810
2060
2273
365
750
750
900
1030
1250
1365
1095
1250
1450
1650
2060
2430
Lead
Pitch
(mils)
100
70
70
70
70
70
100
100
100
100
100
100
100
100
100
100
100
100
100
Lead
Form/Standoff
(mils)
15
20
20
20
20
20
15
15
15
15
15
15
20
15
15
15
15
15
15
Units
Amkor JEDEC
Per
Dwg No. Dwg No. Tube
00294
31286
31289
31291
31291
31292
00290
00291
30170
00292
00293
30124
30791
30125
00289
00286
00255
00284
30123
MS-001
MO-026
MO-020
MO-020
MO-020
MO-021
MS-001
MS-001
MS-001
MS-001
MS-001
N/A
MO-095
MO-010
MS-011
MS-011
MS-011
MS-011
MS-011
18
20
13
11
11
9
50
25
25
20
18
15
14
20
16
13
11
9
7
PDIP
288/300 mil
400 mil (10.16 mm)
600 mil (15.00 mm)
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
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