data sheet
Features:
LAMINATE
MCM-PBGA
Innovative designs and expanding package offerings provide
a platform from prototype-to-production.
• Ball counts up to 1156
• 13.0 mm to 40.0 mm body sizes
• 1.00, 1.27 & 1.50 mm ball pitch available
• Perimeter, stagger and full ball arrays
• Special packaging for memory available
• 2, 4, or 6 layer construction, ground / power
• Full in-house design capability
• JEDEC MS-034 standard outlines
• MCM under high volume manufacturing in all sites
• Enhanced electrical performance, shorter signal paths
and reduced package parasitics
• 2-8 active devices
• 200-600 wire bonds
• Passives can be added by utilizing the SMT
equipment located in the SiP line
Multi layer PCB, 0 air flow
Pkg
Body Size
PCB
Layer
Cu
Thickness
Theta JA
(°C/W)
MCM-PBGA Packages:
The MCM-PBGA (Multi-Chip Module Plastic Ball Grid
Array) by Amkor incorporates the latest technology
in high-density plastic IC packaging. The high-speed
performance and thermal advantages of the PBGA
package provide the platform to mix semiconductor
technologies such as analog, digital, bipolar, CMOS,
ASIC, memory, etc., in a single IC package.
The affordability of our MCM-PBGAs enable systems
designers to realize their vision of new, advanced
or improved applications. Our designs are optimized
to use standard PBGA package outline tooling to save
you costs and utilize a proven BGA infrastructure.
Additionally, we work with you to produce the most
efficient substrate circuit design that will enhance
the operation and performance of your IC chips.
Our advanced in-house design center and electrical
test support services complete the turn-key solution.
Thermal Performance:
272
388
27.0 x 27.0
35.0 x 35.0
4
4
36
µm
36
µm
19
16
Reliability:
Amkor assures you reliable performance by continuously
monitoring key indices:
• Moisture sensitivity
characterization
• High temp op life
• High temp storage
• Autoclave or unbiased hast
• Temp cycle
JEDEC Level 3
30 °C/60% RH/192 hours
125 °C, 6V, 1000 hours
150 °C, 1000 hours
130 °C/85% RH/96 hours
-55/+125 °C, 1000 cycles
Applications:
Amkor’s MCM-PBGA is an excellent platform for reducing
form factor and size while combining semiconductor
technologies. MCM-PBGAs are perfect for any application
where size, weight, electrical performance, board density
and SMT yields are important considerations, such as
ASICs, cable and DSL modems, wireless telecommunica-
tions and electronic automotive components.
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS 540G
Rev Date: 05 ‘07
data sheet
MCM-PBGA Cross Section
LAMINATE
MCM-PBGA
Process Highlights
Die Thickness (max)
13 mils
Bond Pad Pitch (min)
2.4 mils
Marking
Laser
Ball Inspection
Optical
Pack/Ship Options
Dry Pack
Wafer Backgrinding
Available
Standard Materials
Package substrate
CCL-HL832
Die attach
Ablestik 2300
Au wire
25
µ
m or 30
µ
m
Mold compound
Nitto GE 100L
Solder Balls
63 Sn / 37 Pb
Test Services
Program Generation/Conversion
Product Engineering
Wafer sort
256 Pin x 20 mhz Test System available
-55 °C to + 125 °C Test available
Tape and Reel Services
Burn-in
PBGA Standard Package Offering (mm)
BODY
SIZE
BALL
COUNT
BALL
PITCH
BALL
MATRIX
BALL
DIAM.
PCB THICKNESS
2 LYR
4 LYR
MOLD
CAP
THK
TOTAL PACKAGE
THICKNESS
2 LYR
4LYR
13.0 x 13.0
14.0 x 22.0
15.0 x 15.0
17.0 x 17.0
19.0 x 19.0
23.0 x 23.0
27.0 x 27.0
31.0 x 31.0
35.0 x 35.0
37.5 x 37.5
40.0 x 40.0
144
119
153
121
156/160
196
192/208
256
240
289
324
169
208/217
240/249
289
288/324
484
225
256/272
300/316
356
400
416
676
304/329
360/385
529
516
900
313
352/388
420/456
452
676
580
680
1,156
524
784
564
900
1.0
1.27
1.27
1.27
1.00
1.00
1.00
1.00
1.00
1.00
1.00
1.50
1.27
1.27
1.27
1.00
1.00
1.50
1.27
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.00
1.00
1.27
1.27
1.27
1.27
1.27
1.00
1.00
1.00
1.27
1.27
1.27
1.27
12 x 12 F
7 x 17 F
9 x 17 F
11 x 11 F
14 x 14 P
14 x 14 F
16 x 16 P
16 x 16 F
18 x 18 P
17 x 17 P
18 x 18 P
13 x 13 F
17 x 17 P
17 x 17 P
17 x 17 F
22 x 22 P
22 x 22 F
15 x 15 F
20 x 20 P
20 x 20 P
20 x 20 P
20 x 20 F
26 x 26 P
26 x 26 F
23 x 23 P
23 x 23 P
23 x 23 F
30 x 30 P
30 x 30 F
25 x 25 S
26 x 26 P
26 x 26 P
26 x 26 P
26 x 26 F
34 x 34 P
34 x 34 P
34 x 34 F
28 x 28 P
28 x 28 F
30 x 30 P
30 x 30 F
0.51
0.76
0.76
0.76
0.51
0.51
0.51
0.51
0.51
0.51
0.51
0.76
0.76
0.76
0.76
0.63
0.63
0.76
0.76
0.76
0.76
0.76
0.63
0.63
0.76
0.76
0.76
0.63
0.63
0.76
0.76
0.76
0.76
0.76
0.63
0.63
0.63
0.76
0.76
0.76
0.76
0.36
0.56
0.56
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
0.36
N/A
0.36
0.36
0.36
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
N/A
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.61
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.61
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.56
0.80
0.90
0.90
1.17
0.80
0.80
0.80
0.80
0.80
0.80
0.80
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.17
1.56
2.06
2.06
2.13
1.56
1.56
1.56
1.56
1.56
1.56
1.56
2.13
2.13
2.13
2.13
2.03
2.03
2.13
2.13
2.13
N/A
2.13
2.03
2.03
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
N/A
2.33
2.23
2.23
2.23
2.33
2.33
2.33
2.33
1.76
2.06
2.06
2.33
1.76
1.76
1.76
1.76
1.76
1.76
1.76
2.33
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
2.38
2.33
2.23
2.23
2.33
2.33
2.33
2.23
2.23
2.33
2.33
2.33
2.38
2.33
2.23
2.23
2.23
2.33
2.33
2.33
2.33
Shipping
Low Profile Tray (JEDEC Outline CO-029)
NOTE:
All measurements in mm.
P = Perimeter
F = Full Array
S = Stagger
= Maximum possible ball count (may not be
tooled). Additional depopulated options
are available. Contact account manager
for additional tooling.
www.amkor.com
With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or
damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard
terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.
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