data sheet
Ceramic Flat Pack Package
(FP)
Amkor Technology is committed to continuing to
service this long established standard industry
package. This surface mount package consists of a
co-fired ceramic base that has leads brazed to
either the top or bottom of the package. The lid for
this package can be either ceramic "frit sealed" or
metal "solder sealed". This package provides a
hermetic environment for the IC inside.
Applications:
This IC package technology allows application and
design engineers to maximize the performance
characteristics of semiconductors (silicon, GaAs and
S.A.W.). These packages enable end products
(pagers, portable audio/video, disc drives, radio,
IF & RF devices/components, telecom) to be
reduced in size and weight. Semiconductor
families such as operational amplifiers, drivers,
optoelectronics, controllers, logic, analog, memory,
comparators and more using BiCMOS, CMOS or
other silicon/GaAs/S.A.W. technologies are well
addressed by the LLCC product family.
Features:
CERAMIC
/
HERMETIC
Flat Pack
The Flat Pack package offers a variety of features
for the semiconductor IC industry and Amkor
provides a platform from prototype-to-production:
• Flexible lead / pin counts
• Variety of body sizes
• Hermetic package
• Exceptional thermal and electrical performance
by design
• Multi-layer, ground / power
• Cavity Up / Cavity down configurations
• Cavity package
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
.
www.amkor.com
DS809
Rev Date: 08’02
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