4096-word x 1-bit High Speed CMOS Static RAM
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Hitachi (Renesas ) |
Parts packaging code | DIP |
package instruction | DIP, DIP18,.3 |
Contacts | 18 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Is Samacsys | N |
Maximum access time | 35 ns |
I/O type | SEPARATE |
JESD-30 code | R-PDIP-T18 |
JESD-609 code | e0 |
length | 22 mm |
memory density | 4096 bi |
Memory IC Type | STANDARD SRAM |
memory width | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 18 |
word count | 4096 words |
character code | 4000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4KX1 |
Output characteristics | 3-STATE |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP18,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum standby current | 0.00005 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.08 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 7.62 mm |
Base Number Matches | 1 |
HM6147HLP-35 | HM6147H | HM6147HLP-45 | HM6147HLP-55 | HM6147HP-35 | HM6147HP-45 | HM6147HP-55 | |
---|---|---|---|---|---|---|---|
Description | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM | 4096-word x 1-bit High Speed CMOS Static RAM |
Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Hitachi (Renesas ) | - | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
Parts packaging code | DIP | - | DIP | DIP | DIP | DIP | DIP |
package instruction | DIP, DIP18,.3 | - | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
Contacts | 18 | - | 18 | 18 | 18 | 18 | 18 |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow |
ECCN code | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Is Samacsys | N | - | N | N | N | N | N |
Maximum access time | 35 ns | - | 45 ns | 55 ns | 35 ns | 45 ns | 55 ns |
I/O type | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
JESD-30 code | R-PDIP-T18 | - | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 | R-PDIP-T18 |
JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | e0 |
length | 22 mm | - | 22 mm | 22 mm | 22 mm | 22 mm | 22 mm |
memory density | 4096 bi | - | 4096 bi | 4096 bi | 4096 bi | 4096 bi | 4096 bi |
Memory IC Type | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 1 | - | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | - | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | - | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 18 | - | 18 | 18 | 18 | 18 | 18 |
word count | 4096 words | - | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
character code | 4000 | - | 4000 | 4000 | 4000 | 4000 | 4000 |
Operating mode | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4KX1 | - | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 |
Output characteristics | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Exportable | NO | - | NO | NO | NO | NO | NO |
Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | - | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP18,.3 | - | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
Parallel/Serial | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | - | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
Maximum standby current | 0.00005 A | - | 0.00005 A | 0.00005 A | 0.0008 A | 0.0008 A | 0.0008 A |
Maximum slew rate | 0.08 mA | - | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA | 0.08 mA |
Maximum supply voltage (Vsup) | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | - | NO | NO | NO | NO | NO |
technology | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
Base Number Matches | 1 | - | 1 | 1 | 1 | 1 | 1 |