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MT90826AV

Description
TELECOM, DIGITAL TIME SWITCH, PQFP160
CategoryWireless rf/communication    Telecom circuit   
File Size535KB,46 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
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MT90826AV Overview

TELECOM, DIGITAL TIME SWITCH, PQFP160

MT90826AV Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerZarlink Semiconductor (Microsemi)
package instructionLBGA, BGA144,12X12,40
Reach Compliance Codecompli
JESD-30 codeS-PBGA-B144
JESD-609 codee0
length13 mm
Number of functions1
Number of terminals144
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA144,12X12,40
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.25 mm
Maximum slew rate0.1 mA
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesDIGITAL TIME SWITCH
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm

MT90826AV Related Products

MT90826AV MT90826 MT90826AG MT90826AL MT90826AL1
Description TELECOM, DIGITAL TIME SWITCH, PQFP160 TELECOM, DIGITAL TIME SWITCH, PQFP160 TELECOM, DIGITAL TIME SWITCH, PQFP160 TELECOM, DIGITAL TIME SWITCH, PQFP160 TELECOM, DIGITAL TIME SWITCH, PQFP160
Number of functions 1 1 1 1 1
Number of terminals 144 160 160 160 160
Maximum operating temperature 85 °C 85 Cel 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 Cel -40 °C -40 °C -40 °C
surface mount YES Yes YES YES YES
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING BALL GULL WING GULL WING
Terminal location BOTTOM Four BOTTOM QUAD QUAD
Is it Rohs certified? incompatible - incompatible incompatible conform to
Maker Zarlink Semiconductor (Microsemi) - Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi)
package instruction LBGA, BGA144,12X12,40 - BGA, BGA169,13X13 QFP, QFP160,1.2SQ QFP, QFP160,1.2SQ
Reach Compliance Code compli - compli compli compli
JESD-30 code S-PBGA-B144 - S-PBGA-B160 S-PQFP-G160 S-PQFP-G160
JESD-609 code e0 - e0 e0 e3
length 13 mm - 23 mm 28 mm 28 mm
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA - BGA QFP QFP
Encapsulate equivalent code BGA144,12X12,40 - BGA169,13X13 QFP160,1.2SQ QFP160,1.2SQ
Package shape SQUARE - SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE - GRID ARRAY FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED 250
power supply 3.3 V - 3.3 V 3.3 V 3.3 V
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified
Maximum seat height 1.25 mm - 2.26 mm 4.1 mm 4.1 mm
Maximum slew rate 0.1 mA - 0.1 mA 0.1 mA 0.1 mA
Nominal supply voltage 3.3 V - 3.3 V 3.3 V 3.3 V
technology CMOS - CMOS CMOS CMOS
Telecom integrated circuit types DIGITAL TIME SWITCH - DIGITAL TIME SWITCH DIGITAL TIME SWITCH DIGITAL TIME SWITCH
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) MATTE TIN
Terminal pitch 1 mm - 1.5 mm 0.65 mm 0.65 mm
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED 30
width 13 mm - 23 mm 28 mm 28 mm

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