(1/6)
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLG Series MLG1005S Type
FEATURES
• Nominal inductance values are supported from 0.3 to 390nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
1.0±0.05
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLG 1005 S 2N2 S T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
1005
1.0× 0.5mm (L× W)
(3) Material code
(4) Inductance value
2N2
12N
R10
2.2nH
12nH
100nH
(5) Inductance tolerance
B
C
S
H
J
±0.1nH
±0.2nH
±0.3nH
±3%
±5%
0.5±0.05
(6) Packaging style
0.25±0.1
T
Taping (reel)
SPECIFICATIONS
0.5±0.05
Operating temperature range
Storage temperature range
Weight: 1mg
–55 to +125°C
–55 to +125°C [Unit of products]
PACKAGING STYLE AND QUANTITIES
RECOMMENDED PC BOARD PATTERN
0.4 to 0.6
Packaging style
Taping
Quantity
10000 pieces/reel
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
006-01 / 20070703 / e521_mlg1005.fm
(2/6)
ELECTRICAL CHARACTERISTICS
Inductance
(nH)
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
∗
Inductance
tolerance
±0.1, ±0.2nH
±0.1, ±0.2nH
±0.1, ±0.2nH
±0.1, ±0.2nH
±0.1, ±0.2nH
±0.1, ±0.2nH
±0.1, ±0.2nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.1, ±0.2, 0.3nH
±0.2, ±0.3nH
±0.2, ±0.3nH
±0.2, ±0.3nH
±0.2, ±0.3nH
±3%, ±0.3nH
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
±3, ±5%
Q
min.
—
—
—
—
—
—
—
7
7
7
7
7
7
7
7
7
7
7
7
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
6
6
Test frequency
L, Q (MHz)
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
50
50
Self-resonant
frequency
(GHz)
min.
typ.
10.0
20up
10.0
20up
10.0
20up
10.0
20up
10.0
18.7
10.0
16.4
10.0
17.7
10.0
13.8
10.0
19.3
10.0
11.6
8.00
11.7
8.00
9.6
7.50
9.4
7.50
10.3
7.50
9.3
7.00
8.6
7.00
8.2
6.00
7.3
5.50
6.8
5.00
6.1
5.00
6.7
5.00
6.5
4.50
6.0
4.50
5.4
4.00
5.0
4.00
5.3
4.00
4.7
3.50
4.4
3.00
4.1
3.00
4.0
3.00
3.8
2.50
3.4
2.50
3.0
2.20
2.8
2.00
2.5
1.70
2.2
1.60
2.0
1.40
1.8
1.20
1.6
1.10
1.4
1.00
1.3
0.80
1.1
0.70
1.0
0.70
0.9
0.60
0.8
0.55
0.7
0.50
0.6
0.45
0.5
0.40
0.5
0.35
0.4
0.30
0.4
DC resistance
(Ω)
max.
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.10
0.12
0.15
0.15
0.15
0.15
0.15
0.20
0.20
0.20
0.20
0.20
0.25
0.25
0.25
0.25
0.25
0.25
0.30
0.30
0.35
0.40
0.55
0.60
0.70
0.80
0.90
1.00
1.20
1.30
1.50
1.60
2.00
2.20
3.50
3.80
4.20
4.80
7.00
8.00
typ.
0.01
0.01
0.01
0.01
0.02
0.02
0.04
0.04
0.03
0.04
0.04
0.06
0.05
0.06
0.07
0.08
0.08
0.08
0.09
0.09
0.09
0.11
0.11
0.12
0.13
0.14
0.16
0.15
0.15
0.19
0.20
0.22
0.25
0.35
0.40
0.46
0.53
0.59
0.65
0.75
0.83
0.87
1.01
1.37
1.48
2.44
2.88
3.02
3.54
5.21
5.97
Rated current
(mA)max.
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
900
900
900
800
800
800
800
700
700
700
700
600
600
600
600
500
500
500
500
400
400
350
350
300
300
250
250
200
200
200
200
150
150
150
100
100
50
50
Part No.
MLG1005S0N3
MLG1005S0N4
MLG1005S0N5
MLG1005S0N6
MLG1005S0N7
MLG1005S0N8
MLG1005S0N9
MLG1005S1N0
MLG1005S1N1
MLG1005S1N2
MLG1005S1N3
MLG1005S1N5
MLG1005S1N6
MLG1005S1N8
MLG1005S2N0
MLG1005S2N2
MLG1005S2N4
MLG1005S2N7
MLG1005S3N0
MLG1005S3N3
MLG1005S3N6
MLG1005S3N9
MLG1005S4N3
MLG1005S4N7
MLG1005S5N1
MLG1005S5N6
MLG1005S6N2
MLG1005S6N8
MLG1005S7N5
MLG1005S8N2
MLG1005S9N1
MLG1005S10N
MLG1005S12N
MLG1005S15N
MLG1005S18N
MLG1005S22N
MLG1005S27N
MLG1005S33N
MLG1005S39N
MLG1005S47N
MLG1005S56N
MLG1005S68N
MLG1005S82N
MLG1005SR10
MLG1005SR12
MLG1005SR15
MLG1005SR18
MLG1005SR22
MLG1005SR27
MLG1005SR33
MLG1005SR39
∗
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
: Please specify inductance tolerance, B (±0.1nH), C (±0.2nH), S (±0.3nH), H (±3%) or J (±5%).
• Test equipment
Inductance Q : HP4291A+16193A, or equivalent
SRF: HP8720C, or equivalent
Rdc: YOKOGAWA TYPE7561, or equivalent
• Rated current : Value obtained when current flows and temperature has risen to under 20°C.
• All specifications are subject to change without notice.
006-01 / 20070703 / e521_mlg1005.fm
(3/6)
L, Q vs. FREQUENCY CHARACTERISTICS
Q typ.
1.8GHz
2.0GHz
2.4GHz
500MHz
MLG1005S0N3
∗
T
0.3
0.3
0.3
39
MLG1005S0N4 T
0.4
0.4
0.4
41
MLG1005S0N5 T
0.5
0.5
0.5
26
0.6
0.6
0.6
22
MLG1005S0N6 T
MLG1005S0N7 T
0.7
0.7
0.7
22
0.8
0.8
0.8
26
MLG1005S0N8 T
MLG1005S0N9 T
0.8
0.8
0.8
21
MLG1005S1N0 T
0.9
0.9
0.9
22
1.0
1.0
1.0
23
MLG1005S1N1 T
MLG1005S1N2 T
1.1
1.1
1.1
23
1.2
1.2
1.2
22
MLG1005S1N3 T
MLG1005S1N5 T
1.4
1.5
1.5
23
MLG1005S1N6 T
1.5
1.6
1.6
23
1.7
1.7
1.7
20
MLG1005S1N8 T
MLG1005S2N0 T
1.9
1.9
1.9
21
2.1
2.1
2.2
22
MLG1005S2N2 T
2.3
2.3
2.4
21
MLG1005S2N4 T
MLG1005S2N7 T
2.6
2.7
2.7
22
3.0
3.0
3.1
24
MLG1005S3N0 T
MLG1005S3N3 T
3.3
3.4
3.5
24
3.6
3.6
3.8
21
MLG1005S3N6 T
MLG1005S3N9 T
3.9
3.9
4.1
22
MLG1005S4N3 T
4.3
4.4
4.6
24
MLG1005S4N7 T
4.8
4.9
5.2
23
MLG1005S5N1 T
5.4
5.6
6.1
23
MLG1005S5N6 T
5.8
5.9
6.3
22
MLG1005S6N2 T
6.8
7.1
7.8
24
MLG1005S6N8 T
7.4
7.8
8.6
23
MLG1005S7N5 T
8.6
9.2
10.5
24
MLG1005S8N2 T
9.3
9.9
11.3
23
MLG1005S9N1 T
10.8
11.6
13.7
24
MLG1005S10N T
12.4
13.5
16.7
24
MLG1005S12N T
16.2
18.3
25.5
23
MLG1005S15N T
22.0
26.0
41.7
23
MLG1005S18N T
29.0
36.1
74.4
23
MLG1005S22N T
44.5
65.1
341.5
22
MLG1005S27N T
92.4
317.8
20
MLG1005S33N T
314.7
20
MLG1005S39N T
20
MLG1005S47N T
19
MLG1005S56N T
19
17
MLG1005S68N T
MLG1005S82N T
16
MLG1005SR10 T
14
MLG1005SR12 T
12
MLG1005SR15 T
11
8
MLG1005SR18 T
MLG1005SR22 T
5
MLG1005SR27 T
1
MLG1005SR33 T
MLG1005SR39 T
∗
: Please specify inductance tolerance, B (±0.1nH), C (±0.2nH), S (±0.3nH), H (±3%) or J (±5%).
Part No.
Inductance(nH)typ.
500MHz
800MHz
0.3
0.3
0.4
0.4
0.5
0.5
0.6
0.6
0.7
0.7
0.8
0.8
0.9
0.8
0.9
0.9
1.0
1.0
1.1
1.1
1.2
1.2
1.4
1.4
1.5
1.5
1.7
1.7
1.9
1.9
2.1
2.1
2.3
2.3
2.6
2.6
2.9
2.9
3.2
3.2
3.4
3.4
3.7
3.7
4.1
4.1
4.5
4.5
4.9
4.9
5.4
5.4
6.0
6.0
6.5
6.6
7.2
7.4
7.9
8.0
8.8
9.0
9.7
9.9
11.7
12.1
14.7
15.3
17.7
18.6
21.8
23.3
27.0
29.6
33.5
37.8
40.3
46.9
50.2
63.2
60.9
80.2
75.8
107.5
96.9
164.8
128.9
325.8
175.2
284.7
422.4
874.6
800MHz
48
48
32
27
28
34
27
29
29
29
27
29
29
26
25
27
26
27
29
30
26
28
30
30
29
28
29
28
30
28
30
30
29
28
28
27
23
23
21
20
18
15
11
6
1
1.8GHz
99
98
58
46
45
57
44
48
47
48
44
47
46
41
41
44
42
43
47
46
40
43
47
45
42
42
42
40
41
38
40
37
33
29
26
21
10
3
2.0GHz
117
109
63
49
49
60
47
50
50
50
47
50
49
43
43
47
44
45
49
48
42
45
49
47
43
43
43
41
41
38
39
36
31
26
22
14
3
2.4GHz
127
117
69
53
54
66
53
56
57
56
53
56
54
49
48
52
49
50
54
53
46
50
53
50
44
45
43
41
39
36
36
31
23
17
11
2
• All specifications are subject to change without notice.
006-01 / 20070703 / e521_mlg1005.fm
(4/6)
TYPICAL ELECTRICAL CHARACTERISTICS
INDUCTANCE vs. FREQUENCY CHARACTERISTICS
1000
270nH
100
100nH
33nH
10
10nH
3.3nH
1
1.0nH
Q vs. FREQUENCY CHARACTERISTICS
50
1.0nH
40
10nH
30
Q
3.3nH
Inductance (nH)
20
100nH
33nH
10
270nH
0
10
100
Frequency(MHz)
1000
10000
0
10
100
1000
Frequency(MHz)
10000
• All specifications are subject to change without notice.
006-01 / 20070703 / e521_mlg1005.fm
(5/6)
MLG Series MLG1005M Type (For Wireless LAN & Bluetooh)
FEATURES
• Nominal inductance values are supported from 0.6 to 5.6nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
The most suitable in high frequency circuit of 2.4GHz and 5GHz
wireless LAN & Bluetooh.
SHAPES AND DIMENSIONS
1.0±0.05
PRODUCT IDENTIFICATION
MLG 1005 M 2N2 B T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
1005
1.0× 0.5mm(L× W)
(3) Material code
(4) Inductance value
2N2
5N6
2.2nH
5.6nH
(5) Inductance tolerance
B
±0.1nH
0.5±0.05
(6) Packaging style
T
Taping (reel)
0.25±0.1
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C [Unit of products]
0.5±0.05
PACKAGING STYLE AND QUANTITIES
Weight: 1mg
Packaging style
Taping
Quantity
15000 pieces/reel
RECOMMENDED PC BOARD PATTERN
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
300°C. Soldering time should not exceed 3 seconds.
0.4 to 0.6
0.4 to 0.5 0.4 to 0.5 0.4 to 0.5
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• All specifications are subject to change without notice.
006-01 / 20070703 / e521_mlg1005.fm
Integrated technical exchanges
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