|
5962-8685921YA |
5962-8685923YA |
5962-8685919YA |
Description |
CDIP-22, Tube |
CDIP-22, Tube |
CDIP-22, Tube |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Parts packaging code |
CDIP |
CDIP |
CDIP |
package instruction |
DIP, DIP22,.3 |
DIP, DIP22,.3 |
DIP, DIP22,.3 |
Contacts |
22 |
22 |
22 |
Manufacturer packaging code |
CD22 |
CD22 |
CD22 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
ECCN code |
3A001.A.2.C |
3A001.A.2.C |
3A001.A.2.C |
Maximum access time |
45 ns |
35 ns |
55 ns |
I/O type |
COMMON |
COMMON |
COMMON |
JESD-30 code |
R-CDIP-T22 |
R-CDIP-T22 |
R-CDIP-T22 |
JESD-609 code |
e0 |
e0 |
e0 |
length |
27.555 mm |
27.555 mm |
27.555 mm |
memory density |
65536 bit |
65536 bit |
65536 bit |
Memory IC Type |
OTHER SRAM |
OTHER SRAM |
OTHER SRAM |
memory width |
4 |
4 |
4 |
Humidity sensitivity level |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
Number of ports |
1 |
1 |
1 |
Number of terminals |
22 |
22 |
22 |
word count |
16384 words |
16384 words |
16384 words |
character code |
16000 |
16000 |
16000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
organize |
16KX4 |
16KX4 |
16KX4 |
Output characteristics |
3-STATE |
3-STATE |
3-STATE |
Exportable |
NO |
NO |
NO |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
DIP |
DIP |
DIP |
Encapsulate equivalent code |
DIP22,.3 |
DIP22,.3 |
DIP22,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
IN-LINE |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
power supply |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Filter level |
MIL-STD-883 |
MIL-STD-883 |
MIL-STD-883 |
Maximum seat height |
5.08 mm |
5.08 mm |
5.08 mm |
Maximum standby current |
0.001 A |
0.001 A |
0.001 A |
Minimum standby current |
2 V |
2 V |
2 V |
Maximum slew rate |
0.09 mA |
0.115 mA |
0.09 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
surface mount |
NO |
NO |
NO |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
TIN LEAD |
TIN LEAD |
TIN LEAD |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
7.62 mm |
7.62 mm |
7.62 mm |
Base Number Matches |
1 |
1 |
1 |
Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
- |