8200802JX datasheet, PDF - EEWORLD Datasheet

8200802JX: DescriptionOTP ROM, 4KX8, 55ns, Bipolar, CDIP24, DIP-24; Categorystorage storage; File Size455KB，20 Pages; ManufacturerAMD; Websitehttp://www.amd.com

Download Datasheet Parametric Compare View All

8200802JX Overview

OTP ROM, 4KX8, 55ns, Bipolar, CDIP24, DIP-24

Parameter Name	Attribute value
Maker	AMD
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	55 ns
JESD-30 code	R-GDIP-T24
length	32.0675 mm
memory density	32768 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4KX8
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.715 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

	8200802JX	8200802JA
Description	OTP ROM, 4KX8, 55ns, Bipolar, CDIP24, DIP-24	OTP ROM, 4KX8, 55ns, Bipolar, CDIP24, 1.290 X 0.610 X 0.225 INCH, DIP-24
Maker	AMD	AMD
Parts packaging code	DIP	DIP
package instruction	DIP,	DIP,
Contacts	24	24
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
Maximum access time	55 ns	55 ns
JESD-30 code	R-GDIP-T24	R-GDIP-T24
length	32.0675 mm	32.0675 mm
memory density	32768 bit	32768 bit
Memory IC Type	OTP ROM	OTP ROM
memory width	8	8
Number of functions	1	1
Number of terminals	24	24
word count	4096 words	4096 words
character code	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
organize	4KX8	4KX8
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	5.715 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	NO	NO
technology	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL
width	15.24 mm	15.24 mm
Base Number Matches	1	1

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components