74F407SDC datasheet, PDF - EEWORLD Datasheet

74F407SDC: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, CDIP24; CategoryThe embedded processor and controller Microcontrollers and processors; File Size466KB，7 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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74F407SDC Overview

SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP,
Reach Compliance Code	unknown
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	32.77 mm
Number of terminals	24
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Maximum seat height	5.08 mm
surface mount	NO
technology	TTL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

	74F407SDC	74F407SC	74F407SPC	74F407SPCQR
Description	SPECIALTY MICROPROCESSOR CIRCUIT, CDIP24	SPECIALTY MICROPROCESSOR CIRCUIT, PDSO24, SOIC-24	SPECIALTY MICROPROCESSOR CIRCUIT, PDIP24	IC,REGISTER FILE,F-TTL,DIP,24PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP,	SOP,	DIP,	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-GDIP-T24	R-PDSO-G24	R-PDIP-T24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0
Number of terminals	24	24	24	24
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE
surface mount	NO	YES	NO	NO
technology	TTL	BIPOLAR	TTL	TTL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1
length	32.77 mm	15.4 mm	30.095 mm	-
Maximum seat height	5.08 mm	2.65 mm	5.08 mm	-
width	7.62 mm	7.5 mm	7.62 mm	-
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	-

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