|
DAC082S085CISD |
DAC082S085CISDX |
DAC082S085CIMMX |
DAC082S085CIMM |
Description |
Digital to Analog Converters - DAC 8-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-WSON -40 to 105 |
Digital to Analog Converters - DAC 8-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-WSON -40 to 105 |
Digital to Analog Converters - DAC 8-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-VSSOP -40 to 105 |
8-Bit Micro Power DUAL Digital-to-Analog Converter with Rail-to-Rail Output 10-VSSOP -40 to 105 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
Parts packaging code |
SON |
SON |
MSOP |
MSOP |
package instruction |
HVSON, SOLCC10,.11,20 |
HVSON, SOLCC10,.11,20 |
TSSOP, TSSOP10,.19,20 |
TSSOP, TSSOP10,.19,20 |
Contacts |
10 |
10 |
10 |
10 |
Reach Compliance Code |
_compli |
_compli |
_compli |
_compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum analog output voltage |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Converter type |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
D/A CONVERTER |
Enter bit code |
BINARY |
BINARY |
BINARY |
BINARY |
Input format |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
JESD-30 code |
S-PDSO-N10 |
S-PDSO-N10 |
S-PDSO-G10 |
S-PDSO-G10 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
length |
3 mm |
3 mm |
3 mm |
3 mm |
Maximum linear error (EL) |
0.1953% |
0.1953% |
0.1953% |
0.1953% |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
Number of digits |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
Number of terminals |
10 |
10 |
10 |
10 |
Maximum operating temperature |
105 °C |
105 °C |
105 °C |
105 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVSON |
HVSON |
TSSOP |
TSSOP |
Encapsulate equivalent code |
SOLCC10,.11,20 |
SOLCC10,.11,20 |
TSSOP10,.19,20 |
TSSOP10,.19,20 |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
power supply |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
0.8 mm |
0.8 mm |
1.09 mm |
1.09 mm |
Maximum stabilization time |
4.5 µs |
4.5 µs |
4.5 µs |
4.5 µs |
Nominal settling time (tstl) |
3 µs |
3 µs |
3 µs |
3 µs |
Maximum slew rate |
0.41 mA |
0.41 mA |
0.41 mA |
0.41 mA |
Nominal supply voltage |
3 V |
3 V |
3 V |
3 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
NO LEAD |
NO LEAD |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3 mm |
3 mm |
3 mm |
3 mm |
Base Number Matches |
1 |
1 |
1 |
1 |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
- |