WS512K32-55G2LC datasheet, PDF

WS512K32-55G2LC: DescriptionSRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68; Categorystorage storage; File Size577KB，11 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/; Environmental Compliance

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WS512K32-55G2LC Overview

SRAM Module, 512KX32, 55ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	White Electronic Designs Corporation
package instruction	22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Code	unknown
Maximum access time	55 ns
Other features	USER CONFIGURABLE AS 2M X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	S-CQFP-G68
JESD-609 code	e4
length	22.36 mm
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX32
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Encapsulate equivalent code	QFP68,.99SQ,50
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.1 mm
Maximum standby current	0.028 A
Minimum standby current	2 V
Maximum slew rate	0.66 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	22.36 mm
Base Number Matches	1

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