D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, DOUBLE WIDTH, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SIPEX |
package instruction | DOUBLE WIDTH, DIP-24 |
Reach Compliance Code | unknown |
Converter type | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY |
Input format | PARALLEL, 8 BITS |
JESD-30 code | R-XDIP-T24 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.003% |
Number of digits | 14 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | UNSPECIFIED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.6 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 4.318 mm |
Maximum stabilization time | 3 µs |
Maximum slew rate | 1 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
Base Number Matches | 1 |
DAC9331-14-1 | DAC9331-14-2 | |
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Description | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, DOUBLE WIDTH, DIP-24 | D/A Converter, 1 Func, Parallel, 8 Bits Input Loading, DOUBLE WIDTH, DIP-24 |
Is it Rohs certified? | incompatible | incompatible |
Maker | SIPEX | SIPEX |
package instruction | DOUBLE WIDTH, DIP-24 | DOUBLE WIDTH, DIP-24 |
Reach Compliance Code | unknown | unknown |
Converter type | D/A CONVERTER | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
Input format | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
JESD-30 code | R-XDIP-T24 | R-XDIP-T24 |
JESD-609 code | e0 | e0 |
Maximum linear error (EL) | 0.003% | 0.003% |
Number of digits | 14 | 14 |
Number of functions | 1 | 1 |
Number of terminals | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C |
Package body material | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP24,.6 | DIP24,.6 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified |
Maximum seat height | 4.318 mm | 4.318 mm |
Maximum stabilization time | 3 µs | 3 µs |
Nominal supply voltage | 5 V | 15 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
width | 15.24 mm | 15.24 mm |
Base Number Matches | 1 | 1 |