|
AT89LS53-12JC |
AT89LS53 |
AT89LS53_06 |
AT89LS53-12PI |
AT89LS53-12PC |
AT89LS53-12JI |
AT89LS53-12AI |
Description |
8-Bit Microcontroller with 12K Bytes Flash |
8-Bit Microcontroller with 12K Bytes Flash |
8-Bit Microcontroller with 12K Bytes Flash |
8-Bit Microcontroller with 12K Bytes Flash |
8-Bit Microcontroller with 12K Bytes Flash |
8-Bit Microcontroller with 12K Bytes Flash |
8-Bit Microcontroller with 12K Bytes Flash |
Is it Rohs certified? |
incompatible |
- |
- |
incompatible |
incompatible |
incompatible |
incompatible |
Parts packaging code |
LPCC |
- |
- |
DIP |
DIP |
LPCC |
QFP |
package instruction |
PLASTIC, MS-018AC, LCC-44 |
- |
- |
0.600 INCH, PLASTIC, MS-011AC, DIP-40 |
0.600 INCH, PLASTIC, MS-011AC, DIP-40 |
PLASTIC, MS-018AC, LCC-44 |
10 X 10 MM, 1.0 MM HEIGHT, 0.80 MM PITCH, PLASTIC, TQFP-44 |
Contacts |
44 |
- |
- |
40 |
40 |
44 |
44 |
Reach Compliance Code |
unknow |
- |
- |
unknown |
unknown |
unknow |
unknow |
Has ADC |
NO |
- |
- |
NO |
NO |
NO |
NO |
Address bus width |
16 |
- |
- |
16 |
16 |
16 |
16 |
bit size |
8 |
- |
- |
8 |
8 |
8 |
8 |
CPU series |
8051 |
- |
- |
8051 |
8051 |
8051 |
8051 |
maximum clock frequency |
12 MHz |
- |
- |
12 MHz |
12 MHz |
12 MHz |
12 MHz |
DAC channel |
NO |
- |
- |
NO |
NO |
NO |
NO |
DMA channel |
NO |
- |
- |
NO |
NO |
NO |
NO |
External data bus width |
8 |
- |
- |
8 |
8 |
8 |
8 |
JESD-30 code |
S-PQCC-J44 |
- |
- |
R-PDIP-T40 |
R-PDIP-T40 |
S-PQCC-J44 |
S-PQFP-G44 |
JESD-609 code |
e0 |
- |
- |
e0 |
e0 |
e0 |
e0 |
length |
16.5862 mm |
- |
- |
52.3 mm |
52.3 mm |
16.5862 mm |
10 mm |
Humidity sensitivity level |
2 |
- |
- |
1 |
1 |
2 |
3 |
Number of I/O lines |
32 |
- |
- |
32 |
32 |
32 |
32 |
Number of terminals |
44 |
- |
- |
40 |
40 |
44 |
44 |
Maximum operating temperature |
70 °C |
- |
- |
85 °C |
70 °C |
85 °C |
85 °C |
PWM channel |
NO |
- |
- |
NO |
NO |
NO |
NO |
Package body material |
PLASTIC/EPOXY |
- |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
- |
- |
DIP |
DIP |
QCCJ |
TQFP |
Encapsulate equivalent code |
LDCC44,.7SQ |
- |
- |
DIP40,.6 |
DIP40,.6 |
LDCC44,.7SQ |
TQFP44,.47SQ,32 |
Package shape |
SQUARE |
- |
- |
RECTANGULAR |
RECTANGULAR |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER |
- |
- |
IN-LINE |
IN-LINE |
CHIP CARRIER |
FLATPACK, THIN PROFILE |
Peak Reflow Temperature (Celsius) |
225 |
- |
- |
225 |
225 |
225 |
240 |
power supply |
3/5 V |
- |
- |
3/5 V |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
- |
- |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
RAM (bytes) |
256 |
- |
- |
256 |
256 |
256 |
256 |
rom(word) |
12288 |
- |
- |
12288 |
12288 |
12288 |
12288 |
ROM programmability |
FLASH |
- |
- |
FLASH |
FLASH |
FLASH |
FLASH |
Maximum seat height |
4.57 mm |
- |
- |
4.826 mm |
4.826 mm |
4.57 mm |
1.2 mm |
speed |
12 MHz |
- |
- |
12 MHz |
12 MHz |
12 MHz |
12 MHz |
Maximum slew rate |
25 mA |
- |
- |
25 mA |
25 mA |
25 mA |
25 mA |
Maximum supply voltage |
6 V |
- |
- |
6 V |
6 V |
6 V |
6 V |
Minimum supply voltage |
2.7 V |
- |
- |
2.7 V |
2.7 V |
2.7 V |
2.7 V |
Nominal supply voltage |
5 V |
- |
- |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
- |
- |
NO |
NO |
YES |
YES |
technology |
CMOS |
- |
- |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
- |
- |
INDUSTRIAL |
COMMERCIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
- |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
- |
- |
THROUGH-HOLE |
THROUGH-HOLE |
J BEND |
GULL WING |
Terminal pitch |
1.27 mm |
- |
- |
2.54 mm |
2.54 mm |
1.27 mm |
0.8 mm |
Terminal location |
QUAD |
- |
- |
DUAL |
DUAL |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
30 |
- |
- |
30 |
30 |
30 |
30 |
width |
16.5862 mm |
- |
- |
15.24 mm |
15.24 mm |
16.5862 mm |
10 mm |
uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER |
- |
- |
MICROCONTROLLER |
MICROCONTROLLER |
MICROCONTROLLER |
MICROCONTROLLER |
Base Number Matches |
- |
- |
- |
1 |
1 |
1 |
1 |