MC10109
Dual 4-5-Input OR/NOR
Gate
The MC10109 is a dual 4–5 input OR/NOR gate.
•
P
D
= 30 mW typ/gate (No Load)
•
t
pd
= 2.0 ns typ
•
t
r
, t
f
= 2.0 ns typ (20%–80%)
LOGIC DIAGRAM
4
5
6
7
9
10
11
12
13
V
CC1
= PIN 1
V
CC2
= PIN 16
V
EE
= PIN 8
3
2
CDIP–16
L SUFFIX
CASE 620
1
14
15
PDIP–16
P SUFFIX
CASE 648
1
1
PLCC–20
FN SUFFIX
CASE 775
10109
AWLYYWW
16
MC10109P
AWLYYWW
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MARKING
DIAGRAMS
16
MC10109L
AWLYYWW
DIP
PIN ASSIGNMENT
V
CC1
A
OUT
A
OUT
A
IN
A
IN
A
IN
A
IN
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
B
OUT
B
OUT
B
IN
B
IN
B
IN
B
IN
B
IN
A
WL
YY
WW
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
MC10109L
MC10109P
MC10109FN
Package
CDIP–16
PDIP–16
PLCC–20
Shipping
25 Units / Rail
25 Units / Rail
46 Units / Rail
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
©
Semiconductor Components Industries, LLC, 2002
1
January, 2002 – Rev. 7
Publication Order Number:
MC10109/D
MC10109
ELECTRICAL CHARACTERISTICS
Test Limits
Pin
Under
Test
8
4
4
2
3
2
3
2
3
2
3
0.5
–1.060
–1.060
–1.890
–1.890
–1.080
–1.080
–1.655
–1.655
–0.890
–0.890
–1.675
–1.675
–30°C
Min
Max
15
425
0.5
–0.960
–0.960
–1.850
–1.850
–0.980
–0.980
–1.630
–1.630
–0.810
–0.810
–1.650
–1.650
Min
+25°C
Typ
11
Max
14
265
0.3
–0.890
–0.890
–1.825
–1.825
–0.910
–0.910
–1.595
–1.595
–0.700
–0.700
–1.615
–1.615
Min
+85°C
Max
15
265
Unit
mAdc
µAdc
µAdc
Vdc
Vdc
Vdc
Vdc
ns
t
4+2+
t
4–2–
t
4+3–
t
4–3+
t
2+
t
3+
t
2–
t
3–
2
2
3
3
2
3
2
3
1.0
1.0
1.0
1.0
1.1
1.1
1.1
1.1
3.7
3.7
3.7
3.7
4.0
4.0
4.0
4.0
1.0
1.0
1.0
1.0
1.1
1.1
1.1
1.1
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.0
2.9
2.9
2.9
2.9
3.3
3.3
3.3
3.3
1.0
1.0
1.0
1.0
1.1
1.1
1.1
1.1
3.7
3.7
3.7
3.7
4.0
4.0
4.0
4.0
Characteristic
Power Supply Drain Current
Input Current
Symbol
I
E
I
inH
I
inL
Output Voltage
Output Voltage
Threshold Voltage
Threshold Voltage
Logic 1
Logic 0
Logic 1
Logic 0
V
OH
V
OL
V
OHA
V
OLA
Switching Times (50Ω Load)
Propagation Delay
Rise Time
Fall Time
(20 to 80%)
(20 to 80%)
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2
MC10109
ELECTRICAL CHARACTERISTICS
(continued)
TEST VOLTAGE VALUES
(Volts)
@ Test Temperature
–30°C
+25°C
+85°C
Pin
Under
Test
8
4
4
2
3
2
3
2
3
2
3
4
4
4
V
IHmax
–0.890
–0.810
–0.700
V
ILmin
–1.890
–1.850
–1.825
V
IHAmin
–1.205
–1.105
–1.035
V
ILAmax
–1.500
–1.475
–1.440
V
EE
–5.2
–5.2
–5.2
(V
CC
)
Gnd
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
+2.0 V
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
1, 16
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
V
IHmax
V
ILmin
V
IHAmin
V
ILAmax
V
EE
8
8
8
8
8
8
8
4
4
4
4
Pulse In
Pulse Out
2
2
3
3
2
3
2
3
8
8
8
8
–3.2 V
8
8
8
8
8
8
8
8
Characteristic
Power Supply Drain Current
Input Current
Symbol
I
E
I
inH
I
inL
Output Voltage
Output Voltage
Threshold Voltage
Threshold Voltage
Switching Times
Propagation Delay
Logic 1
Logic 0
Logic 1
Logic 0
(50Ω Load)
V
OH
V
OL
V
OHA
V
OLA
4
t
4+2+
t
4–2–
t
4+3–
t
4–3+
(20 to 80%)
(20 to 80%)
t
2+
t
3+
t
2–
t
3–
2
2
3
3
2
3
2
3
4
4
4
4
4
4
4
4
Rise Time
Fall Time
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
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3
MC10109
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
B
–N–
Y BRK
D
–L–
–M–
W
D
X
V
A
Z
R
0.007 (0.180)
0.007 (0.180)
M
0.007 (0.180)
U
M
T L-M
M
S
N
S
S
0.007 (0.180)
T L-M
N
S
Z
20
1
G1
0.010 (0.250)
S
T L-M
S
N
S
VIEW D–D
T L-M
T L-M
S
N
N
S
H
0.007 (0.180)
M
T L-M
S
N
S
M
S
S
K1
K
C
E
0.004 (0.100)
G
G1
0.010 (0.250)
S
T L-M
J
–T–
SEATING
PLANE
F
VIEW S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
0.007 (0.180)
M
T L-M
S
N
S
VIEW S
S
N
S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
---
0.025
---
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
---
0.020
2
_
10
_
0.310
0.330
0.040
---
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
---
0.64
---
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
---
0.50
2
_
10
_
7.88
8.38
1.02
---
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4
MC10109
PACKAGE DIMENSIONS
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
–A–
16
9
–B–
1
8
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
---
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
---
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
_
15
_
0.51
1.01
–T–
SEATING
PLANE
N
E
F
D
G
16 PL
K
M
J
16 PL
0.25 (0.010)
M
M
T B
S
0.25 (0.010)
T A
S
–A–
16
9
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
–T–
H
G
D
16 PL
SEATING
PLANE
K
J
T A
M
M
0.25 (0.010)
M
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