|
IRHE93230 |
IRHE9230 |
Description |
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-18) |
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-18) |
Is it lead-free? |
Contains lead |
Contains lead |
Maker |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
Parts packaging code |
LCC |
LCC |
package instruction |
CHIP CARRIER, R-CQCC-N15 |
CHIP CARRIER, R-CQCC-N15 |
Contacts |
18 |
18 |
Reach Compliance Code |
unknow |
compli |
ECCN code |
EAR99 |
EAR99 |
Avalanche Energy Efficiency Rating (Eas) |
171 mJ |
171 mJ |
Shell connection |
SOURCE |
SOURCE |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
200 V |
200 V |
Maximum drain current (ID) |
4 A |
4 A |
Maximum drain-source on-resistance |
0.92 Ω |
0.92 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JESD-30 code |
R-CQCC-N15 |
R-CQCC-N15 |
Number of components |
1 |
1 |
Number of terminals |
15 |
15 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Maximum operating temperature |
150 °C |
150 °C |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
Polarity/channel type |
P-CHANNEL |
P-CHANNEL |
Maximum pulsed drain current (IDM) |
16 A |
16 A |
Certification status |
Not Qualified |
Not Qualified |
surface mount |
YES |
YES |
Terminal form |
NO LEAD |
NO LEAD |
Terminal location |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
transistor applications |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |