Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | BGA |
package instruction | 2 X 2 MM, 0.60 MM HEIGHT, MICRO, CSP-16 |
Contacts | 16 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Nominal bandwidth | 22 kHz |
Commercial integrated circuit types | AUDIO AMPLIFIER |
Gain | 3.52 dB |
JESD-30 code | S-PBGA-B16 |
JESD-609 code | e0 |
length | 2.02 mm |
Humidity sensitivity level | 1 |
Number of channels | 2 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Nominal output power | 0.08 W |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA14,4X4,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3 V |
Certification status | Not Qualified |
Maximum seat height | 0.67 mm |
Maximum slew rate | 8.4 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | BICMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 20 |
width | 2.02 mm |
Base Number Matches | 1 |