M37267EESP datasheet, PDF - EEWORLD Datasheet

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M37267EESP: DescriptionSINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size6MB，80 Pages; ManufacturerMitsubishi; Websitehttp://www.mitsubishielectric.com/semiconductors/

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M37267EESP Overview

SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER

M37267EESP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Mitsubishi
Parts packaging code	DIP
package instruction	SDIP, SDIP52,.6
Contacts	52
Reach Compliance Code	unknow
Is Samacsys	N
Has ADC	YES
Address bus width
bit size	8
CPU series	MELPS740
maximum clock frequency	8.1 MHz
DAC channel	NO
DMA channel	NO
External data bus width
JESD-30 code	R-PDIP-T52
JESD-609 code	e0
length	45.85 mm
Number of I/O lines	39
Number of terminals	52
Maximum operating temperature	70 °C
Minimum operating temperature	-10 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	SDIP
Encapsulate equivalent code	SDIP52,.6
Package shape	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	1536
rom(word)	57344
ROM programmability	OTPROM
Maximum seat height	5.5 mm
speed	8 MHz
Maximum slew rate	45 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.778 mm
Terminal location	DUAL
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

M37267EESP Related Products

	M37267EESP	M37267	M37267EE-XXXSP	M37267M4-XXXSP	M37267xx	M37267M6-XXXSP	M37267M8-XXXSP
Description	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER WITH CLOSED CAPTION DECODER AND ON-SCREEN DISPLAY CONTROLLER
Is it Rohs certified?	incompatible	-	incompatible	incompatible	-	incompatible	incompatible
Maker	Mitsubishi	-	Mitsubishi	Mitsubishi	-	Mitsubishi	Mitsubishi
Parts packaging code	DIP	-	DIP	DIP	-	DIP	DIP
package instruction	SDIP, SDIP52,.6	-	SDIP, SDIP52,.6	SDIP, SDIP52,.6	-	SDIP, SDIP52,.6	SDIP, SDIP52,.6
Contacts	52	-	52	52	-	52	52
Reach Compliance Code	unknow	-	unknow	unknow	-	unknow	unknow
Has ADC	YES	-	YES	YES	-	YES	YES
bit size	8	-	8	8	-	8	8
CPU series	MELPS740	-	MELPS740	MELPS740	-	MELPS740	MELPS740
maximum clock frequency	8.1 MHz	-	8.1 MHz	8.1 MHz	-	8.1 MHz	8.1 MHz
DAC channel	NO	-	NO	NO	-	NO	NO
DMA channel	NO	-	NO	NO	-	NO	NO
JESD-30 code	R-PDIP-T52	-	R-PDIP-T52	R-PDIP-T52	-	R-PDIP-T52	R-PDIP-T52
JESD-609 code	e0	-	e0	e0	-	e0	e0
length	45.85 mm	-	45.85 mm	45.85 mm	-	45.85 mm	45.85 mm
Number of I/O lines	39	-	39	39	-	39	39
Number of terminals	52	-	52	52	-	52	52
Maximum operating temperature	70 °C	-	70 °C	70 °C	-	70 °C	70 °C
Minimum operating temperature	-10 °C	-	-10 °C	-10 °C	-	-10 °C	-10 °C
PWM channel	YES	-	YES	YES	-	YES	YES
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SDIP	-	SDIP	SDIP	-	SDIP	SDIP
Encapsulate equivalent code	SDIP52,.6	-	SDIP52,.6	SDIP52,.6	-	SDIP52,.6	SDIP52,.6
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, SHRINK PITCH	-	IN-LINE, SHRINK PITCH	IN-LINE, SHRINK PITCH	-	IN-LINE, SHRINK PITCH	IN-LINE, SHRINK PITCH
power supply	5 V	-	5 V	5 V	-	5 V	5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
RAM (bytes)	1536	-	1536	896	-	960	1024
rom(word)	57344	-	57344	16384	-	24576	32768
ROM programmability	OTPROM	-	OTPROM	MROM	-	MROM	MROM
Maximum seat height	5.5 mm	-	5.5 mm	5.5 mm	-	5.5 mm	5.5 mm
speed	8 MHz	-	8 MHz	8 MHz	-	8 MHz	8 MHz
Maximum slew rate	45 mA	-	45 mA	45 mA	-	45 mA	45 mA
Maximum supply voltage	5.5 V	-	5.5 V	5.5 V	-	5.5 V	5.5 V
Minimum supply voltage	4.5 V	-	4.5 V	4.5 V	-	4.5 V	4.5 V
Nominal supply voltage	5 V	-	5 V	5 V	-	5 V	5 V
surface mount	NO	-	NO	NO	-	NO	NO
technology	CMOS	-	CMOS	CMOS	-	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	-	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.778 mm	-	1.778 mm	1.778 mm	-	1.778 mm	1.778 mm
Terminal location	DUAL	-	DUAL	DUAL	-	DUAL	DUAL
width	15.24 mm	-	15.24 mm	15.24 mm	-	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER	-	MICROCONTROLLER	MICROCONTROLLER
Peak Reflow Temperature (Celsius)	-	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
Maximum time at peak reflow temperature	-	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED

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