|
HMPP-3860 |
HMPP-3862 |
HMPP-3865 |
HMPP-386X |
Description |
50 V, SILICON, PIN DIODE |
50 V, SILICON, PIN DIODE |
50 V, SILICON, PIN DIODE |
50 V, SILICON, PIN DIODE |
Is it Rohs certified? |
incompatible |
conform to |
incompatible |
- |
Maker |
HP(Keysight) |
HP(Keysight) |
HP(Keysight) |
- |
Parts packaging code |
DIE |
DIE |
DIE |
- |
package instruction |
R-XUUC-N4 |
R-XUUC-N4 |
R-XUUC-N4 |
- |
Contacts |
4 |
4 |
4 |
- |
Reach Compliance Code |
unknown |
unknow |
unknown |
- |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
- |
application |
ATTENUATOR; SWITCHING |
ATTENUATOR; SWITCHING |
ATTENUATOR; SWITCHING |
- |
Minimum breakdown voltage |
50 V |
50 V |
50 V |
- |
Configuration |
SINGLE |
SEPARATE, 2 ELEMENTS |
SEPARATE, 2 ELEMENTS |
- |
Maximum diode capacitance |
0.2 pF |
0.2 pF |
0.2 pF |
- |
Nominal diode capacitance |
0.2 pF |
0.2 pF |
0.2 pF |
- |
Diode component materials |
SILICON |
SILICON |
SILICON |
- |
Maximum diode forward resistance |
22 Ω |
22 Ω |
22 Ω |
- |
Diode resistance test current |
1 mA |
1 mA |
1 mA |
- |
Diode resistance test frequency |
100 MHz |
100 MHz |
100 MHz |
- |
Diode type |
PIN DIODE |
PIN DIODE |
PIN DIODE |
- |
JESD-30 code |
R-XUUC-N4 |
R-XUUC-N4 |
R-XUUC-N4 |
- |
JESD-609 code |
e0 |
e3 |
e0 |
- |
Minority carrier nominal lifetime |
0.5 µs |
0.5 µs |
0.5 µs |
- |
Number of components |
2 |
2 |
2 |
- |
Number of terminals |
4 |
4 |
4 |
- |
Maximum operating temperature |
150 °C |
150 °C |
150 °C |
- |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
Package form |
UNCASED CHIP |
UNCASED CHIP |
UNCASED CHIP |
- |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Reverse test voltage |
50 V |
50 V |
50 V |
- |
surface mount |
YES |
YES |
YES |
- |
technology |
POSITIVE-INTRINSIC-NEGATIVE |
POSITIVE-INTRINSIC-NEGATIVE |
POSITIVE-INTRINSIC-NEGATIVE |
- |
Terminal surface |
Tin/Lead (Sn/Pb) |
MATTE TIN |
Tin/Lead (Sn/Pb) |
- |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
- |
Terminal location |
UPPER |
UPPER |
UPPER |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Base Number Matches |
1 |
1 |
1 |
- |