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DF15B08-50DS-065V56

Description
Board to Board & Mezzanine Connectors 50P RECP .8MM HEIGHT W/FITTING, NO BOSS
CategoryThe connector   
File Size282KB,10 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
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DF15B08-50DS-065V56 Overview

Board to Board & Mezzanine Connectors 50P RECP .8MM HEIGHT W/FITTING, NO BOSS

DF15B08-50DS-065V56 Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerHirose
Product CategoryBoard to Board & Mezzanine Connectors
RoHSDetails
ProductReceptacles
PackagingReel
NumOfPackaging1
Factory Pack Quantity1000
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
0.65mm Pitch SMT Board to Board Connector
DF15 Series
Corresponding to automatic mounting
The vacuum area is secured the automatic mounting
machine for vacuum.
Figure 1
sFeatures
1. Compatibility of Miniaturization with Service Efficiency
This series considers the service efficiency to set the pitch to 0.65mm, corresponding to the 0.5mm pitch DF12 series. This connector
widely covers the definition of the mounting space or the board to board size together with the DF12 series.
2. Broad Variations in Board to Board Size
The board to board size is specified at 1mm step between 4mm and 8mm.
Header/Receptacle
DF15#(3.2)-*DP-0.65V
DF15#(4.2)-*DP-0.65V
DF15#(6.2)-*DP-0.65V
DF15#(0.8)-*DS-0.65V
4
5
7
DF15#(1.8)-*DS-0.65V
5
6
8
Combinnation with H size Combinnation with H size
Note1: The stacking height is determined by adding the header and receptacle to the figures followed by the product name
DF15#.
Note2: The stacking height (H size) doesn't include the soldering paste thickness.
3. Correspond to Automatic Mounting
The connector has the vacuum area, which enables the automatic mounting by the embossed tape packaging.
4. Metal Fitting Available
The product including the metal fitting to prevent solder peeling is prepared, considering the mounting on FPC.
sApplications
Mobile phone, LCD(Liquid Crystal Display), MO(Optical Disk), Note PC
A156

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