|
EDI8F81024C100BSC |
EDI8F81024C |
EDI8F81024C85BSC |
Description |
1Mx8 Static RAM CMOS, Module |
1Mx8 Static RAM CMOS, Module |
1Mx8 Static RAM CMOS, Module |
Is it Rohs certified? |
incompatible |
- |
incompatible |
Maker |
White Electronic Designs Corporation |
- |
White Electronic Designs Corporation |
package instruction |
SIP-36 |
- |
SIP-36 |
Reach Compliance Code |
unknow |
- |
unknow |
Maximum access time |
100 ns |
- |
85 ns |
I/O type |
COMMON |
- |
COMMON |
JESD-30 code |
R-XSMA-T36 |
- |
R-XSMA-T36 |
memory density |
8388608 bi |
- |
8388608 bi |
Memory IC Type |
SRAM MODULE |
- |
SRAM MODULE |
memory width |
8 |
- |
8 |
Number of functions |
1 |
- |
1 |
Number of terminals |
36 |
- |
36 |
word count |
1048576 words |
- |
1048576 words |
character code |
1000000 |
- |
1000000 |
Operating mode |
ASYNCHRONOUS |
- |
ASYNCHRONOUS |
Maximum operating temperature |
70 °C |
- |
70 °C |
organize |
1MX8 |
- |
1MX8 |
Output characteristics |
3-STATE |
- |
3-STATE |
Package body material |
UNSPECIFIED |
- |
UNSPECIFIED |
encapsulated code |
SIMM |
- |
SIMM |
Encapsulate equivalent code |
SIP36 |
- |
SIP36 |
Package shape |
RECTANGULAR |
- |
RECTANGULAR |
Package form |
MICROELECTRONIC ASSEMBLY |
- |
MICROELECTRONIC ASSEMBLY |
Parallel/Serial |
PARALLEL |
- |
PARALLEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
power supply |
5 V |
- |
5 V |
Certification status |
Not Qualified |
- |
Not Qualified |
Maximum standby current |
0.02 A |
- |
0.02 A |
Minimum standby current |
4.5 V |
- |
4.5 V |
Maximum slew rate |
0.13 mA |
- |
0.13 mA |
Maximum supply voltage (Vsup) |
5.5 V |
- |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
- |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
- |
5 V |
surface mount |
NO |
- |
NO |
technology |
CMOS |
- |
CMOS |
Temperature level |
COMMERCIAL |
- |
COMMERCIAL |
Terminal form |
THROUGH-HOLE |
- |
THROUGH-HOLE |
Terminal location |
SINGLE |
- |
SINGLE |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |