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CR2512-JW-272ELF

Description
Thick Film Resistors - SMD CHIP RESISTOR
CategoryPassive components    The resistor   
File Size312KB,3 Pages
ManufacturerBourns
Websitehttp://www.bourns.com
Environmental Compliance
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CR2512-JW-272ELF Overview

Thick Film Resistors - SMD CHIP RESISTOR

CR2512-JW-272ELF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerBourns
package instructionCHIP, ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time12 weeks
Samacsys DescriptionThick Film Resistors - SMD CHIP RESISTOR
structureRECTANGULAR PACKAGE
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.6 mm
Package length6.3 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width3.2 mm
method of packingTR, Embossed, 7 Inch
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance2700 Ω
Resistor typeFIXED RESISTOR
size code2512
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage200 V
OM
PL
IA
N
T
Features
n
RoHS compliant*
*R
oH
S
222
LE
AD
F
RE
E
CR2512 - 1 W
n
Tight tolerances of bottom electrode width
n
Three layer termination process with nickel
barrier prevents leaching and provides
excellent solderability
n
Power rating at 70 °C: CR2010 - 1/2 W,
n
Suitable for most types of soldering
processes
n
Standard packaging on tape and reel
n
AEC-Q200 approval upon request
C
CR2010/CR2512 - Chip Resistors
Derating Curve
Model
Model
CR2010
CR2512
1/2 W
1W
-55 °C to +155 °C
+155 °C
200 V
400 V
Electrical Characteristics
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Characteristic
Power Rating @ 70 °C
Operating Temperature Range
Derated to 0 Load at
Maximum Working Voltage
Maximum Overload Voltage
100
Rated Power (%)
80
60
40
20
0
-55
0
70
155
Resistance Range: 1 %
E-96 + E-24
10 ohms ≤ R ≤ 1M ohms
±100 PPM/°C
Ambient Temperature (°C)
Resistance Range: 5 %
E-24
Zero Ohm Jumper <0.05 ohm
Rated/Maximum Current
Chip Dimensions
Dimension
L
W
H
I1
I2
Model
CR2010
5.00 ± 0.20
(0.197 ± 0.008)
1M ohms < R ≤ 10M ohms
±200 PPM/°C
10 ohms ≤ R ≤ 10M ohms
±200 PPM/°C
1 ohm ≤ R < 10 ohms
10M ohms < R ≤ 20M ohms
±400 PPM/°C
2 A/5 A
For Standard Values Used in Capacitors,
Inductors, and Resistors,
click here.
Dimensional Drawings
Dimensional Drawing
I1
I1
2 A/5 A
H
2.50 ± 0.20
(0.098 ± 0.008)
0.60 ± 0.10
(0.024 ± 0.004)
0.60 ± 0.25
(0.024 ± 0.010)
Model
CR2512
6.30 ± 0.20
(0.248 ± 0.008)
I2
L
I2
W
0.60 ± 0.25
(0.024 ± 0.010)
3.10 ± 0.20
(0.122 ± 0.008)
0.60 ± 0.15
(0.024 ± 0.006)
0.60 ± 0.25
(0.024 ± 0.010)
DIMENSIONS:
MM
(INCHES)
0.60 ± 0.25
(0.024 ± 0.010)
Performance Characteristics
Test
Thermal Shock
Short Time Overload
Resistance to Solder Heat
Resistance to Dry Heat
Load Life
Load Life with Humidity
Solderability
Bending
Dielectric Withstanding
Voltage
Insulation Resistance
Procedure
-55 ℃ for 30 minutes, +155 ℃ for 30 minutes,
5 cycles
2.5 X rated voltage for 5 seconds
270 ±5 ℃ for 10 ±1 seconds
125 ±5 ℃ for 96 ±4 hours
Rated voltage for 1000 hours, 70 ℃,
1.5 hours “ON“, 0.5 hours “OFF”
Rated voltage for 1000 hours, 40 ±2 ℃,
90~95 % RH, 1.5 hours “ON“, 0.5 hours “OFF”
245 ±5 ℃, 2 ±0.5 seconds
3 mm
--
100 V
Method
IEC60115-1-4.19
IEC60115-1-4.13
IEC60115-1-4.18
IEC60115-1-4.23.2
IEC60115-1-4.25.1
IEC60115-1-4.24
IEC60115-1-4.17
IEC60115-1-4.33
IEC60115-1-4.7
IEC60115-1-4.6
1%
Test Limits
DR
5%
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(2 % + 0.1 Ω)
≤±(1 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
≤±(3 % + 0.1 Ω)
≤±(3 % + 0.1 Ω)
≥95 % of area covered
≤±(0.5 % + 0.05 Ω)
≤±(1 % + 0.05 Ω)
>500 V
≥1 GΩ
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.

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