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IXFH58N20Q

Description
58 A, 200 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247
Categorysemiconductor    Discrete semiconductor   
File Size355KB,2 Pages
ManufacturerIXYS ( Littelfuse )
Websitehttp://www.ixys.com/
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IXFH58N20Q Overview

58 A, 200 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247

IXFH58N20Q Parametric

Parameter NameAttribute value
Number of terminals3
Minimum breakdown voltage200 V
Processing package descriptionTO-247, 3 PIN
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
packaging shapeRECTANGULAR
Package SizeFLANGE MOUNT
Terminal formTHROUGH-HOLE
terminal coatingTIN SILVER COPPER
Terminal locationSINGLE
Packaging MaterialsPLASTIC/EPOXY
structureSINGLE WITH BUILT-IN DIODE
Shell connectionDRAIN
Number of components1
transistor applicationsSWITCHING
Transistor component materialsSILICON
Channel typeN-CHANNEL
field effect transistor technologyMETAL-OXIDE SEMICONDUCTOR
operating modeENHANCEMENT
Transistor typeGENERAL PURPOSE POWER
Maximum leakage current58 A
Rated avalanche energy1000 mJ
Maximum drain on-resistance0.0400 ohm
Maximum leakage current pulse232 A
HiPerFET
TM
Power MOSFETs
Q-Class
N-Channel Enhancement Mode
Avalanche Rated High dv/dt, Low Q
g
Preliminary data sheet
Symbol
V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt
P
D
T
J
T
JM
T
stg
T
L
M
d
Weight
1.6 mm (0.062 in.) from case for 10 s
Mounting torque
TO-247
TO-268
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C; R
GS
= 1 MΩ
Continuous
Transient
T
C
= 25°C
T
C
= 25°C, pulse width limited by T
JM
T
C
= 25°C
T
C
= 25°C
T
C
= 25°C
I
S
I
DM
, di/dt
100 A/µs, V
DD
V
DSS
,
T
J
150°C, R
G
= 2
T
C
= 25°C
IXFH 58N20Q
IXFT 58N20Q
V
DSS
I
D25
R
DS(on)
= 200 V
=
58 A
=
40 mW
t
rr
£
200 ns
Maximum Ratings
200
200
±20
±30
58
232
58
30
1.0
5
300
-55 ... +150
150
-55 ... +150
300
6
4
V
V
V
V
A
A
A
mJ
J
V/ns
W
°C
°C
°C
°C
g
g
TO-268 (D3) (IXFT) Case Style
G
S
(TAB)
TO-247 AD
(TAB)
G = Gate
S = Source
D = Drain
TAB = Drain
Features
l
l
l
1.13/10 Nm/lb.in.
Symbol
Test Conditions
(T
J
= 25°C, unless otherwise specified)
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 250
µA
V
DS
= V
GS
, I
D
= 4 mA
V
GS
=
±20
V
DC
, V
DS
= 0
V
DS
= V
DSS
V
GS
= 0 V
T
J
= 25°C
T
J
= 125°C
Characteristic Values
Min. Typ.
Max.
200
2.0
4.0
±100
25
1
40
V
V
nA
µA
mA
m
l
l
l
IXYS advanced low Q
g
process
International standard packages
Low gate charge and capacitance
- easier to drive
- faster switching
Low R
DS (on)
Unclamped Inductive Switching (UIS)
rated
Molding epoxies meet UL 94 V-0
flammability classification
Advantages
l
l
l
V
GS
= 10 V, I
D
= 0.5 I
D25
Pulse test, t
300
µs,
duty cycle d
2 %
Easy to mount
Space savings
High power density
© 1999 IXYS All rights reserved
98523A (5/99)

IXFH58N20Q Related Products

IXFH58N20Q IXFT58N20Q IXFT58N20Q TRL
Description 58 A, 200 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247 58 A, 200 V, 0.04 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247 MOSFET N-CH 200V 58A TO268
Number of terminals 3 3 -
Minimum breakdown voltage 200 V 200 V -
Processing package description TO-247, 3 PIN TO-247, 3 PIN -
Lead-free Yes Yes -
EU RoHS regulations Yes Yes -
state ACTIVE ACTIVE -
packaging shape RECTANGULAR RECTANGULAR -
Package Size FLANGE MOUNT FLANGE MOUNT -
Terminal form THROUGH-HOLE THROUGH-HOLE -
terminal coating TIN SILVER COPPER TIN SILVER COPPER -
Terminal location SINGLE SINGLE -
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY -
structure SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE -
Shell connection DRAIN DRAIN -
Number of components 1 1 -
transistor applications SWITCHING SWITCHING -
Transistor component materials SILICON SILICON -
Channel type N-CHANNEL N-CHANNEL -
field effect transistor technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR -
operating mode ENHANCEMENT ENHANCEMENT -
Transistor type GENERAL PURPOSE POWER GENERAL PURPOSE POWER -
Maximum leakage current 58 A 58 A -
Rated avalanche energy 1000 mJ 1000 mJ -
Maximum drain on-resistance 0.0400 ohm 0.0400 ohm -
Maximum leakage current pulse 232 A 232 A -
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