OM
PL
IA
N
Features
n
1210 size
n
Magnetic shielding
n
High Q characteristic
n
High current rating
n
RoHS compliant*
F
RE
E
LE
AD
*R
oH
S
C
T
CMH322522 Series - Shielded Wirewound Chip Inductor
General Specifications
Test
Freq. MHz
L,Q
SRF
MHz
Min.
DCR
W
Max.
Irms
mA
Max.
Electrical Specifications
Bourns
Part No.
Inductance
Q
Min.
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
CMH322522-R10ML
CMH322522-R12ML
CMH322522-R15ML
CMH322522-R18ML
CMH322522-R22ML
CMH322522-R27ML
CMH322522-R33ML
CMH322522-R39ML
CMH322522-R47ML
CMH322522-R56ML
CMH322522-R68ML
CMH322522-R82ML
CMH322522-1R0KL
CMH322522-1R2KL
CMH322522-1R5KL
CMH322522-1R8KL
CMH322522-2R2KL
CMH322522-2R7KL
CMH322522-3R3KL
CMH322522-3R9KL
CMH322522-4R7KL
CMH322522-5R6KL
CMH322522-6R8KL
CMH322522-8R2KL
CMH322522-100KL
CMH322522-120KL
CMH322522-150KL
CMH322522-180KL
CMH322522-220KL
CMH322522-270KL
CMH322522-330KL
CMH322522-390KL
CMH322522-470KL
CMH322522-560KL
CMH322522-680KL
CMH322522-820KL
CMH322522-101KL
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
µH
Tol. %
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
30
20
100
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
25.2
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
700
500
450
400
350
320
300
250
220
180
160
140
120
100
85
80
75
70
55
50
45
40
35
30
28
20
20
20
19
18
16
15
13
12
11
10
9
0.44
0.22
0.25
0.25
0.32
0.36
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.85
0.90
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.1
2.5
2.8
3.3
3.7
5.0
5.6
6.4
7.0
8.0
9.0
10
10
450
450
450
450
450
450
450
450
450
450
450
450
400
390
370
350
320
290
260
250
220
200
180
170
150
140
130
120
110
80
70
65
60
55
50
45
40
Temperature Rise
.................20 °C max. at rated current
Operating Temperature
................................-55 °C to +125 °C
Storage Temperature
................................-55 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
.............................. 260 °C, 5 seconds
Materials
Core ..............................................Ferrite
Terminal Electrode ........................Cu/Sn
Packaging ................. 2,000 pcs. per reel
3.20 ± 0.2
(.126 ± .008
Product Dimensions
010
3.20 ± 0.2
(.126 ± .008
2.20 ± 0.2
(.087 ± .008)
TYP.
0.5
(.020)
0.60
TYP.
(.024)
2.50 ± 0.2
(.098 ± .008)
(
1.90 ± 0.1
(.036 ± .004)
Recommended Layout
4.4
(.173)
(
2.0
(.079)
2.0
(.079)
DIMENSIONS:
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MM
(INCHES)
Applications
n
Prevention of electromagnetic interference
to signals on the secondary side of
electronic equipment
SRF0504 Series - Line Filter
CMH322522 Series - Shielded Wirewound Chip Inductor
Packaging Specifications
178.0 ± 2.0
DIA.
(7.00 ± 0.79)
2.0
±
0.5
(.079
±
.020)
9.0 ± 0.5
(.354 ± .020)
13.5
±
0.5
(.531
±
.020)
DIA.
13.5
±
0.5
DIA.
(.531
±
.020)
13.5
±
0.5
DIA.
(.531
±
.020)
2.0 ± 0.05
(.079 ± .002)
1.75 ± 0.1
(.069 ± .004)
4.0 ± 0.1
(.157 ± .004)
1.5 ± 0.1
(.059 ± .004)
.26 ± .05
(.010 ± .002)
3.65 ± 0.1
(.144 ± .004)
8.0 ± 0.1
(.315 ± .004)
3.5 ± 0.05
(.138 ± .002)
4.0 ± 0.1
(.157 ± .004)
1.1 ± 0.1
(.043 ± .004)
2.88 ± 0.1
(.113 ± .004)
2.50 ± 0.1
(.098 ± .020)
DIMENSIONS:
MM
(INCHES)
REV. 01/16
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Recruitment
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