Latches 3.3V 8-BIT ADDRSSBLE LATCH
| Parameter Name | Attribute value |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | SSOP |
| package instruction | 5.30 MM, PLASTIC, MO-150, SOT338, SSOP-16 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| Other features | 1:8 DMUX FOLLOWED BY LATCH |
| series | LV/LV-A/LVX/H |
| JESD-30 code | R-PDSO-G16 |
| JESD-609 code | e4 |
| length | 6.2 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | D LATCH |
| MaximumI(ol) | 0.006 A |
| Humidity sensitivity level | 1 |
| Number of digits | 1 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Output polarity | TRUE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SSOP |
| Encapsulate equivalent code | SSOP16,.3 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, SHRINK PITCH |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Prop。Delay @ Nom-Sup | 36 ns |
| propagation delay (tpd) | 60 ns |
| Certification status | Not Qualified |
| Maximum seat height | 2 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 1 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | NICKEL PALLADIUM GOLD |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Trigger type | LOW LEVEL |
| width | 5.3 mm |
| Base Number Matches | 1 |
| 74LV259DB-T | 74LV259PW-T | 74LV259PW | 74LV259N | 74LV259D | 74LV259DB | |
|---|---|---|---|---|---|---|
| Description | Latches 3.3V 8-BIT ADDRSSBLE LATCH | Latches 8BIT ADDRESSBL LATCH | Latches 3.3V 8-BIT ADDRSSBLE LATCH | Latches 8BIT ADDRESSBL LATCH | Latches 3.3V 8-BIT ADDRSSBLE LATCH | |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| Parts packaging code | SSOP | TSSOP | TSSOP | DIP | SOIC | SSOP |
| package instruction | 5.30 MM, PLASTIC, MO-150, SOT338, SSOP-16 | 4.40 MM, PLASTIC, MO-153, SOT403, TSSOP-16 | 4.40 MM, PLASTIC, MO-153, SOT403, TSSOP-16 | 0.300 INCH, PLASTIC, SOT38, DIP-16 | 3.90 MM, PLASTIC, MS-012, SOT109, SOP-16 | 5.30 MM, PLASTIC, MO-150, SOT338, SSOP-16 |
| Contacts | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Other features | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH | 1:8 DMUX FOLLOWED BY LATCH |
| series | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H | LV/LV-A/LVX/H |
| JESD-30 code | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609 code | e4 | e4 | e4 | e4 | e4 | e4 |
| length | 6.2 mm | 5 mm | 5 mm | 19.025 mm | 9.9 mm | 6.2 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH | D LATCH |
| MaximumI(ol) | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| Number of digits | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SSOP | TSSOP | TSSOP | DIP | SOP | SSOP |
| Encapsulate equivalent code | SSOP16,.3 | TSSOP16,.25 | TSSOP16,.25 | DIP16,.3 | SOP16,.25 | SSOP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns | 36 ns |
| propagation delay (tpd) | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns | 60 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2 mm | 1.1 mm | 1.1 mm | 4.2 mm | 1.75 mm | 2 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm | 1.27 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | NOT SPECIFIED | 30 | 30 |
| Trigger type | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL | LOW LEVEL |
| width | 5.3 mm | 4.4 mm | 4.4 mm | 7.62 mm | 3.9 mm | 5.3 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| Humidity sensitivity level | 1 | 1 | 1 | - | 1 | 1 |
| Is it lead-free? | - | - | Lead free | Lead free | Lead free | Lead free |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
