8-bit Microcontrollers - MCU 64K FLASH W/2K EEPROM
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | NXP |
| Parts packaging code | LCC |
| package instruction | PLASTIC, LCC-52 |
| Contacts | 52 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Has ADC | YES |
| Address bus width | |
| bit size | 8 |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | S-PQCC-J52 |
| JESD-609 code | e3 |
| length | 19.125 mm |
| Humidity sensitivity level | 3 |
| Number of I/O lines | 50 |
| Number of terminals | 52 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| PWM channel | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 220 |
| Certification status | Not Qualified |
| ROM programmability | FLASH |
| Maximum seat height | 4.57 mm |
| speed | 8.4 MHz |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | HCMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 19.125 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |
| MC908AS60ACFNER | MC908AS60AVFUE | MC908AZ60AVFUER | |
|---|---|---|---|
| Description | 8-bit Microcontrollers - MCU 64K FLASH W/2K EEPROM | 8-bit Microcontrollers - MCU 64K FLASH W/2K EEPROM | 8-bit Microcontrollers - MCU 64KFLASH W/2K EEPROM |
| Is it Rohs certified? | conform to | conform to | - |
| Maker | NXP | NXP | - |
| Parts packaging code | LCC | QFP | - |
| package instruction | PLASTIC, LCC-52 | 20 X 20 MM, PLASTIC, QFP-64 | - |
| Contacts | 52 | 64 | - |
| Reach Compliance Code | unknown | unknown | - |
| ECCN code | EAR99 | EAR99 | - |
| Has ADC | YES | YES | - |
| bit size | 8 | 8 | - |
| DAC channel | NO | NO | - |
| DMA channel | NO | NO | - |
| JESD-30 code | S-PQCC-J52 | S-PQFP-G64 | - |
| JESD-609 code | e3 | e3 | - |
| length | 19.125 mm | 14 mm | - |
| Humidity sensitivity level | 3 | 3 | - |
| Number of I/O lines | 50 | 50 | - |
| Number of terminals | 52 | 64 | - |
| Maximum operating temperature | 85 °C | 105 °C | - |
| Minimum operating temperature | -40 °C | -40 °C | - |
| PWM channel | YES | YES | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | QCCJ | QFP | - |
| Package shape | SQUARE | SQUARE | - |
| Package form | CHIP CARRIER | FLATPACK | - |
| Peak Reflow Temperature (Celsius) | 220 | 260 | - |
| Certification status | Not Qualified | Not Qualified | - |
| ROM programmability | FLASH | FLASH | - |
| Maximum seat height | 4.57 mm | 2.45 mm | - |
| speed | 8.4 MHz | 8.4 MHz | - |
| Maximum supply voltage | 5.5 V | 5.5 V | - |
| Minimum supply voltage | 4.5 V | 4.5 V | - |
| Nominal supply voltage | 5 V | 5 V | - |
| surface mount | YES | YES | - |
| technology | HCMOS | HCMOS | - |
| Temperature level | INDUSTRIAL | INDUSTRIAL | - |
| Terminal surface | Matte Tin (Sn) | TIN | - |
| Terminal form | J BEND | GULL WING | - |
| Terminal pitch | 1.27 mm | 0.8 mm | - |
| Terminal location | QUAD | QUAD | - |
| Maximum time at peak reflow temperature | 30 | 40 | - |
| width | 19.125 mm | 14 mm | - |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | - |
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