CYStech Electronics Corp.
Spec. No. : C336SG
Issued Date : 2003.06.01
Revised Date :
Page No. : 1/3
CASD501SG
Surface Mount Small Signal Schottky Barrier Diodes
Features
•
For surface mounted application
•
Extremely low V
F
•
Extremely Thin Package
•
Low Stored Charge
•
Majority Carrier Conduction
Mechanical Data
•
Case: Molded Plastic, JEDEC SOD-323.
•
Terminals: Solder plated, solderable per MIL-STD-750 Method 2026
•
Polarity: Indicated by cathode band.
•
Mounting Position : Any.
•
Weight: 0.0045 gram, 0.000159 ounce
Maximum Ratings
(Ta=25℃, unless otherwise noted)
Parameter
Repetitive Peak Reverse Voltage
Continuous Reverse Voltage
Average Rectified Current
Peak Forward Surge Current
Typical Junction Capacitance
Operating Temperature Range
Storage Temperature Range
Symbol
V
RM
V
R
I
O
I
FSM
C
D
T
J
T
STG
Conditions
min
typ
max
45
40
100
unit
V
V
mA
mA
pF
+125
+125
°C
°C
8.3ms single half sine-wave
superimposed on rated load
(JEDEC method)
f = 1MHz and applied 10VDC
Reverse Voltage
-40
-40
1000
20
Electrical Characteristics
(Ta=25℃, unless otherwise noted)
Parameter
Forward Voltage
Reverse Leakage Current
Symbol
V
F
I
R
Conditions
I
F
= 100mA DC
V
R
= 10V DC
min
typ
max
0.55
30
unit
V
µA
CASD501SG
CYStek Product Specification
CYStech Electronics Corp.
Characteristic Curves
Forward Characteristics
100
10000
Spec. No. : C336SG
Issued Date : 2003.06.01
Revised Date :
Page No. : 2/3
Reverse Characteristics
1
25℃
Forward Current---I
F
(mA)
125℃
2
5℃
Reverse Current---I
R
(μA)
1000
7
5℃
10
-
25℃
100
75℃
10
25℃
1
1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.1
0
10
20
30
40
Forward Voltage---V
F
(V)
Reverse Voltage---V
R
(V)
Forward Current Derating Curve
(Mounting on glass epoxy PCBs)
120
Diode Capacitance vs Reverse Voltage
100
Diode Capacitance---C
D
(pF)
Percentage of Average Forward
Current---(%)
100
80
60
40
20
0
0
25
50
75
100
125
150
10
1
0
5
Ambient Temperature---Ta(℃)
10
15
20
25
Reverse Voltage---V
R
(V)
30
35
CASD501SG
CYStek Product Specification
CYStech Electronics Corp.
SOD-323 Dimension
Spec. No. : C336SG
Issued Date : 2003.06.01
Revised Date :
Page No. : 3/3
SOD-323 Plastic Surface
Mounted Package
CYStek Package Code:SG
*:Typical
DIM
A
B
C
Inches
Min.
Max.
0.090
0.106
0.045
0.053
0.012(typ)
Millimeters
Min.
Max.
2.3
2.7
1.15
1.35
0.3(typ)
DIM
D
R
Inches
Min.
Max.
0.028
0.035
0.02(typ)
Millimeters
Min.
Max.
0.7
0.9
0.5(typ)
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CASD501SG
CYStek Product Specification
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