512Kx8 bit Low Power and Low Voltage CMOS Static RAM
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
Parts packaging code | TSOP1 |
package instruction | TSOP1, TSSOP32,.8,20 |
Contacts | 32 |
Reach Compliance Code | compli |
ECCN code | 3A991.B.2.A |
Maximum access time | 85 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-G32 |
JESD-609 code | e0 |
length | 18.4 mm |
memory density | 4194304 bi |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP1 |
Encapsulate equivalent code | TSSOP32,.8,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Minimum standby current | 2 V |
Maximum slew rate | 0.03 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 8 mm |