®
Thermal Data
MULTIWATT Family
8,11,15 leads (JEDEC MO-048 )
8 leads
11 leads
PACKAGE MATERIAL LIST
item #
material
thickness
thermal
conductivity
3.9 W/cm°C
3.9 W/cm°C
15 leads
leadframe
slug
copper
high thermal
conductivity Cu
soft solder
( tin / lead )
epoxy resin
0.5 mm
1.5 mm
die attach
15-50 µm
0.2 W/cm°C
molding
compound
3 mm
0.0063W/cm°C
Typical assembly configuration before molding :
Charts enclosed :
1)
Rth(j-c) vs. die size and dissipating area
2)
Rth(j-a) vs on board heat sink area
3)
Zth(j-a) vs time width and die size
February 1998
1/2
Thermal Data
Rth(j-c) (ºC/W)
MULTIWATT Family
Tcase = 150 ºC
5
4
diss. area
silicon
3
1)
2
die thickness = 375 µm
solder thickness = 25 µm
1
0
1
Rth(j-a) (ºC/W)
50
2
3
4
5
6
Dissipating area on die ( mm )
die size = 20.000 sq.mils
dissipating area = 2000 sq.mils
40
floating in air
mounted on PC board
30
2)
20
mounted on TH17023 heat sink
10
0
0
1
2
3
Dissipated Power ( Watt )
4
5
Transient Thermal Resistance (ºC/W)
100
SINGLE PULSE
30
10
Pd = 2 Watt, mounted on board
die size = 35.000 sq.mils
dissipating area = 2.000 sq.mils
3
3)
1
0.3
Pd = 2 Watt, mounted on board
die size = 175x195 sq.mils
dissipating area =16.000 sq.mils
0.1
0.03
0.001
0.01
0.1
1
Time or pulse width ( s )
10
100
1,000
2/2
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