5962-9559512HBX datasheet, PDF

5962-9559512HBX: DescriptionSRAM Module, 128KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68; Categorystorage storage; File Size3MB，939 Pages; ManufacturerWhite Electronic Designs Corporation; Websitehttp://www.wedc.com/

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5962-9559512HBX Overview

SRAM Module, 128KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68

Parameter Name	Attribute value
package instruction	CERAMIC, QFP-68
Reach Compliance Code	unknown
Maximum access time	55 ns
JESD-30 code	S-CQFP-G68
length	23.875 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	4.06 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
width	23.88 mm
Base Number Matches	1

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