UVPROM, 2KX8, 15ns, CMOS, CQCC28,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Reach Compliance Code | unknown |
Maximum access time | 15 ns |
I/O type | COMMON |
JESD-30 code | S-XQCC-N28 |
memory density | 16384 bit |
Memory IC Type | UVPROM |
memory width | 8 |
Number of terminals | 28 |
word count | 2048 words |
character code | 2000 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 2KX8 |
Output characteristics | REGISTERED |
Package body material | CERAMIC |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC28,.45SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 5 V |
Programming voltage | 13.5 V |
Certification status | Not Qualified |
Filter level | 38535Q/M;38534H;883B |
Maximum standby current | 0.03 A |
Maximum slew rate | 0.092 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Base Number Matches | 1 |
5962-01-380-8204 | WS57C45-35CMB | WS57C45-45FMB | WS57C45-45T | WS57C45-35HMB | WS57C45-45HMB | WS57C45-45CMB | |
---|---|---|---|---|---|---|---|
Description | UVPROM, 2KX8, 15ns, CMOS, CQCC28, | UVPROM, 2KX8, 15ns, CMOS, CQCC28, | UVPROM, 2KX8, 45ns, CMOS, CDFP24, | UVPROM, 2KX8, 25ns, CMOS, CDIP24, | OTP ROM, 2KX8, 35ns, CMOS, CDFP24, | OTP ROM, 2KX8, CMOS, CDFP24, | UVPROM, 2KX8, 25ns, CMOS, CQCC28, |
Reach Compliance Code | unknown | unknown | unknown | unknow | unknow | unknow | unknow |
JESD-30 code | S-XQCC-N28 | S-CQCC-N28 | R-GDFP-F24 | R-GDIP-T24 | R-GDFP-F24 | R-GDFP-F24 | S-CQCC-N28 |
memory density | 16384 bit | 16384 bit | 16384 bit | 16384 bi | 16384 bi | 16384 bi | 16384 bi |
Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM | OTP ROM | OTP ROM | UVPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 28 | 28 | 24 | 24 | 24 | 24 | 28 |
word count | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
character code | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
organize | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
Output characteristics | REGISTERED | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | CHIP CARRIER | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
Terminal form | NO LEAD | NO LEAD | FLAT | THROUGH-HOLE | FLAT | FLAT | NO LEAD |
Terminal location | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | - | incompatible |
Maximum access time | 15 ns | 15 ns | 45 ns | 25 ns | 35 ns | - | 25 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | - | COMMON |
encapsulated code | QCCN | QCCN | DFP | DIP | DFP | - | QCCN |
Encapsulate equivalent code | LCC28,.45SQ | LCC28,.45SQ | FL24,.4 | DIP24,.3 | FL24,.4 | - | LCC28,.45SQ |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
Programming voltage | 13.5 V | 13.5 V | 13.5 V | 13.5 V | 13.5 V | - | 13.5 V |
Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B |
Maximum standby current | 0.03 A | 0.03 A | 0.03 A | 0.02 A | 0.03 A | - | 0.03 A |
Maximum slew rate | 0.092 mA | 0.092 mA | 0.079 mA | 0.069 mA | 0.093 mA | - | 0.079 mA |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | - | 1.27 mm |
JESD-609 code | - | e0 | e0 | e0 | e0 | - | e0 |
Number of functions | - | 1 | 1 | 1 | 1 | 1 | 1 |
Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Parallel/Serial | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
Maker | - | - | Waferscale Integration Inc. | Waferscale Integration Inc. | Waferscale Integration Inc. | Waferscale Integration Inc. | Waferscale Integration Inc. |