Enhanced Product Memorystick(Tm) Interconnect Extender Chipset 20-TSSOP -40 to 125
| Parameter Name | Attribute value |
| Brand Name | Texas Instruments |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Texas Instruments |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP20,.25 |
| Contacts | 20 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 6 weeks |
| Differential output | YES |
| Number of drives | 4 |
| High level input current maximum value | 0.00002 A |
| Input properties | DIFFERENTIAL |
| Interface integrated circuit type | LINE TRANSCEIVER |
| Interface standards | EIA-644-A; TIA-644-A |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e4 |
| length | 6.5 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Minimum output swing | 0.247 V |
| Output characteristics | DIFFERENTIAL |
| Maximum output low current | 0.008 A |
| Output polarity | COMPLEMENTARY |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP20,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum receive delay | 4.8 ns |
| Number of receiver bits | 1 |
| Maximum seat height | 1.2 mm |
| Maximum slew rate | 35 mA |
| Maximum supply voltage | 3.6 V |
| Minimum supply voltage | 3 V |
| Nominal supply voltage | 3.3 V |
| Supply voltage 1-max | 3.6 V |
| Mains voltage 1-minute | 3 V |
| Supply voltage1-Nom | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| maximum transmission delay | 3.9 ns |
| width | 4.4 mm |
| V62/05615-02XE | V62-05615-01XE | V62-05615-02XE | V62/05615-01XE | SN65LVDT14-EP | SN65LVDT41-EP | |
|---|---|---|---|---|---|---|
| Description | Enhanced Product Memorystick(Tm) Interconnect Extender Chipset 20-TSSOP -40 to 125 | LVDS Interface IC Mil Enhance MemStick Intercon Ext Chipset | LVDS Interface IC Mil Enhance MemStick Intercon Ext Chipset | Enhanced Product Memorystick(Tm) Interconnect Extender Chipset 20-TSSOP -40 to 125 | SN65LVDT14-EP Enhanced Product Memorystick(Tm) Interconnect Extender Chipset | SN65LVDT41-EP Enhanced Product Memorystick(Tm) Interconnect Extender Chipset |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD