Ultra-Low Power MSP430 with 64 KB Flash 80-BGA MICROSTAR JUNIOR -40 to 85
Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it Rohs certified? | conform to |
Maker | Texas Instruments |
Parts packaging code | BGA |
package instruction | VFBGA, BGA80,9X9,20 |
Contacts | 80 |
Reach Compliance Code | compliant |
Has ADC | YES |
bit size | 16 |
boundary scan | YES |
CPU series | MSP430 |
DAC channel | NO |
DMA channel | YES |
Integrated cache | NO |
JESD-30 code | S-PBGA-B80 |
JESD-609 code | e1 |
length | 5 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of DMA channels | 3 |
Number of external interrupt devices | 16 |
Number of I/O lines | 53 |
Number of terminals | 80 |
On-chip program ROM width | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA80,9X9,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
RAM (bytes) | 8192 |
rom(word) | 65536 |
ROM programmability | FLASH |
Maximum seat height | 1 mm |
speed | 25 MHz |
Maximum slew rate | 11 mA |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 1.8 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 5 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |